Fabrication and packaging of an inertia electrical micro-switch using low temperature metal-electroplating technology

Wei Ma, Yitshak Zohar, Man Wong

Research output: Contribution to journalArticle

Abstract

Presented in this paper is a separate and non-interfering photoresist-molded, metal-electroplating technology for the low-temperature fabrication and packaging of inertia electrical micro-switch. The low temperature process of the electroplating technology allows eventual modular integration and wafer-level packaging of the micro-switches on active substrates containing pre-fabricated electronic signal-processing circuits. The height of the inertia micro-switch and that of its cavity are independently controlled. Metal leads are provided for electrical access to the sealed cavities. The switches are designed using a simple but accurate lumped spring-mass model. Un-encapsulated switches making over 100 million contacts are demonstrated in room ambient. Both the strength and the hermeticity of the sealed cavity are tested and reported.

Original languageEnglish (US)
Pages (from-to)1239-1244
Number of pages6
JournalPan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors
Volume26
Issue number6
StatePublished - Jun 1 2005
Externally publishedYes

Keywords

  • Electroplating
  • Eutectic solder-bonding
  • Hermeticity
  • Inertia micro-switch
  • Packaging
  • Threshold acceleration

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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