Fabrication and packaging of inertia micro-switch using low-temperature photo-resist molded metal-electroplating technology

Wei Ma, Gang Li, Yitshak Zohar, Man Wong

Research output: Contribution to journalArticle

32 Citations (Scopus)

Abstract

Separate and non-interfering photo-resist molded metal-electroplating processes have been applied to the fabrication of inertia micro-switches and their wafer-level packaging in sealed cavities. The height of a switch and that of its cavity are independently controlled. The low process temperature allows eventual modular integration of switches on active substrates containing pre-fabricated electronic signal-processing circuits. The scheme also provides leads for electrical access to the sealed devices. The switches were designed using a simple but accurate lumped spring-mass model. With the application of an anti-stiction hydrophobic coating, un-encapsulated switches making over 100 million contacts have been demonstrated in room ambient.

Original languageEnglish (US)
Pages (from-to)63-70
Number of pages8
JournalSensors and Actuators, A: Physical
Volume111
Issue number1
DOIs
StatePublished - Mar 1 2004
Externally publishedYes

Fingerprint

electroplating
Electroplating
packaging
inertia
Packaging
switches
Metals
Switches
Fabrication
fabrication
metals
Hermetic devices
Temperature
stiction
Stiction
cavities
rooms
signal processing
Signal processing
wafers

Keywords

  • Anti-stiction coating
  • Electroplating
  • Eutectic solder bonding
  • Inertia micro-switch
  • Packaging
  • Threshold acceleration

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Instrumentation

Cite this

Fabrication and packaging of inertia micro-switch using low-temperature photo-resist molded metal-electroplating technology. / Ma, Wei; Li, Gang; Zohar, Yitshak; Wong, Man.

In: Sensors and Actuators, A: Physical, Vol. 111, No. 1, 01.03.2004, p. 63-70.

Research output: Contribution to journalArticle

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