Fabrication and packaging of inertia microswitch using metal-electroplating technology

Wei Ma, Gang Li, Yitshak Zohar, Man Wong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Separate and non-interfering photoresist-molded metal-electroplating processes have been applied to the fabrication of inertia micro-switches and their wafer-level packaging in sealed cavities formed using eutectic bonding. The height of a switch and that of its cavity are independently controlled. The low process temperature allows eventual modular integration of switches on active substrates containing pre-fabricated electronic signal-processing circuits. The scheme also provides leads for electrical access to the sealed devices. The switches are based on a lateral mechanical resonator design responding to inertia change above a pre-determined threshold value. A simple but accurate lumped spring-mass model is developed based on analytical and numerical studies. Predictions of the behavior of switches with different geometric designs have been verified using both drop-hammer and shaker tests. Switches making over 100 million contacts have been demonstrated in room ambient.

Original languageEnglish (US)
Title of host publicationProceedings of the IEEE Micro Electro Mechanical Systems (MEMS)
Pages610-613
Number of pages4
StatePublished - 2003
Externally publishedYes
EventIEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems - Kyoto, Japan
Duration: Jan 19 2003Jan 23 2003

Other

OtherIEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems
CountryJapan
CityKyoto
Period1/19/031/23/03

Fingerprint

Electroplating
Packaging
Switches
Fabrication
Metals
Hermetic devices
Hammers
Photoresists
Eutectics
Resonators
Signal processing
Networks (circuits)
Substrates

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering
  • Control and Systems Engineering

Cite this

Ma, W., Li, G., Zohar, Y., & Wong, M. (2003). Fabrication and packaging of inertia microswitch using metal-electroplating technology. In Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS) (pp. 610-613)

Fabrication and packaging of inertia microswitch using metal-electroplating technology. / Ma, Wei; Li, Gang; Zohar, Yitshak; Wong, Man.

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS). 2003. p. 610-613.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ma, W, Li, G, Zohar, Y & Wong, M 2003, Fabrication and packaging of inertia microswitch using metal-electroplating technology. in Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS). pp. 610-613, IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems, Kyoto, Japan, 1/19/03.
Ma W, Li G, Zohar Y, Wong M. Fabrication and packaging of inertia microswitch using metal-electroplating technology. In Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS). 2003. p. 610-613
Ma, Wei ; Li, Gang ; Zohar, Yitshak ; Wong, Man. / Fabrication and packaging of inertia microswitch using metal-electroplating technology. Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS). 2003. pp. 610-613
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