Fabrication and packaging of inertia microswitch using metal-electroplating technology

Wei Ma, Gang Li, Yitshak Zohar, Man Wong

Research output: Contribution to conferencePaper

3 Scopus citations

Abstract

Separate and non-interfering photoresist-molded metal-electroplating processes have been applied to the fabrication of inertia micro-switches and their wafer-level packaging in sealed cavities formed using eutectic bonding. The height of a switch and that of its cavity are independently controlled. The low process temperature allows eventual modular integration of switches on active substrates containing pre-fabricated electronic signal-processing circuits. The scheme also provides leads for electrical access to the sealed devices. The switches are based on a lateral mechanical resonator design responding to inertia change above a pre-determined threshold value. A simple but accurate lumped spring-mass model is developed based on analytical and numerical studies. Predictions of the behavior of switches with different geometric designs have been verified using both drop-hammer and shaker tests. Switches making over 100 million contacts have been demonstrated in room ambient.

Original languageEnglish (US)
Pages610-613
Number of pages4
StatePublished - Jul 23 2003
Externally publishedYes
EventIEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems - Kyoto, Japan
Duration: Jan 19 2003Jan 23 2003

Other

OtherIEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems
CountryJapan
CityKyoto
Period1/19/031/23/03

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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