Fabrication issues for free-space optics at the board packaging level

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The succesful application of optical interconnects to electronic processing systems requires careful consideration of the: 1) electronic system in which it will be used, 2) optical system and electro-optical device performance, 3) electrical-electro optic interface characteristics, 4) packaging of micro optic components and electro-optic devices with electronic substrates, and 5) the reliability of optical interconnects. In addition, the optical system must be performance and cost competitive with advanced electrical connection methods. In this presentation we consider several of the above issues at the board packaging level, and the design of relevant optical components for these systems.

Original languageEnglish (US)
Title of host publicationProceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages45-51
Number of pages7
ISBN (Electronic)0818658320, 9780818658327
DOIs
StatePublished - Jan 1 1994
Event1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994 - Cancun, Mexico
Duration: Apr 26 1994Apr 27 1994

Publication series

NameProceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994

Conference

Conference1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994
CountryMexico
CityCancun
Period4/26/944/27/94

Fingerprint

Space optics
Optical interconnects
Electrooptical effects
packaging
Optical systems
Packaging
optical interconnects
Electrooptical devices
optics
Microoptics
Fabrication
fabrication
electro-optics
electronics
Substrates
Processing
costs
Costs

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Hardware and Architecture
  • Atomic and Molecular Physics, and Optics

Cite this

Kostuk, R. K. (1994). Fabrication issues for free-space optics at the board packaging level. In Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994 (pp. 45-51). [336612] (Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MPPOI.1994.336612

Fabrication issues for free-space optics at the board packaging level. / Kostuk, Raymond K.

Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994. Institute of Electrical and Electronics Engineers Inc., 1994. p. 45-51 336612 (Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kostuk, RK 1994, Fabrication issues for free-space optics at the board packaging level. in Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994., 336612, Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994, Institute of Electrical and Electronics Engineers Inc., pp. 45-51, 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994, Cancun, Mexico, 4/26/94. https://doi.org/10.1109/MPPOI.1994.336612
Kostuk RK. Fabrication issues for free-space optics at the board packaging level. In Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994. Institute of Electrical and Electronics Engineers Inc. 1994. p. 45-51. 336612. (Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994). https://doi.org/10.1109/MPPOI.1994.336612
Kostuk, Raymond K. / Fabrication issues for free-space optics at the board packaging level. Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994. Institute of Electrical and Electronics Engineers Inc., 1994. pp. 45-51 (Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994).
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