Fabrication of low loss optical waveguides using a novel photosensitive polyimide

Kazunori Mune, Ryusuke Naito, Takahiro Fukuoka, Amane Mochizuki, Kenji Matsumoto, Nasuhi Yurt, Gerald Meredith, Ghassan Jabbour, Nasser Peyghambarian

Research output: Contribution to journalConference article

7 Scopus citations

Abstract

Fabrication of optical waveguides by a simple patterning process using photosensitive polyimide (PSPI) is described. Light waveguide based on PSPI was fabricated by photolithographic processing without use of dry etching process. The PSPI varnish is comprised of polyamic acid (PAA) which was made from fluorinated diamine and fluorinated tetracarboxylic dianhydride, and photosensitizer. The PSPI has the following characteristics: glass transition temperature (Tg) of 330 °C, coefficient of thermal expansion of 40 ppm/K. Moreover the PSPI is colorless, and posses low absorption at 1.3 and 1.55μm. The sidewalls and the surfaces of the fabricated waveguide are very smooth, which is essential for the low loss optical mode propagation and lower scattering of the mode due to the imperfections. Single and multimode buried ridge waveguides on quartz glass substrate were fabricated and tested. Optical propagation losses were measured by standard cut back method and found to be as low as 0.4 dB/cm @ 1.55 μm. This fabrication process would be expected to contribute to low cost production for high performance opto-electronic devices.

Original languageEnglish (US)
Pages (from-to)103-108
Number of pages6
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume4997
DOIs
StatePublished - Sep 12 2003
EventPhotonics Packaging and Integration III - San Jose, CA, United States
Duration: Jan 28 2003Jan 30 2003

Keywords

  • Clad
  • Core
  • Development
  • Optical loss
  • Photosensitive
  • Polyimide
  • Waveguide

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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