Feasibility of real-time detection of abnormality in inter layer dielectric slurry during chemical mechanical planarization using frictional analysis

Yasa Sampurno, Fransisca Sudargho, Yun Zhuang, Michael Goldstein, Ara Philipossian

Research output: Contribution to journalArticle

18 Scopus citations

Abstract

Material removal rate, coefficient of friction, shear force and variance of shear force of pure and contaminated slurries are studied using spectral analysis of the frictional force. Larger abrasive particles are introduced into commercially available inter layer dielectric chemical mechanical planarization slurry to explore this effect. Results show that trace amounts of larger abrasive particles are transported effectively to the pad-wafer region during polishing. With certain type of consumables investigated in this study, results indicate that contaminated slurry does not significantly change removal rate, however it induces significantly higher coefficient of friction, shear force and variance of shear force than pure slurry. Spectral analysis based on the raw shear force data is employed to elucidate the fundamental physical phenomena during inter layer dielectric chemical mechanical planarization. Fast Fourier Transformation is performed to convert the shear force data from time domain to frequency domain. The energy distribution of polishing using pure and contaminated slurry is quantified to elucidate the effect of trace amount of larger particles. This work also underscores the importance of real-time detection on chemical mechanical planarization process to detect slurries abnormality.

Original languageEnglish (US)
Pages (from-to)7667-7674
Number of pages8
JournalThin Solid Films
Volume516
Issue number21
DOIs
StatePublished - Sep 1 2008

Keywords

  • CMP
  • Chemical mechanical planarization
  • Contamination
  • Friction
  • Frictional forces
  • Planarization
  • Silicon oxide
  • Slurry
  • Spectral analysis
  • Surface defects

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

Fingerprint Dive into the research topics of 'Feasibility of real-time detection of abnormality in inter layer dielectric slurry during chemical mechanical planarization using frictional analysis'. Together they form a unique fingerprint.

Cite this