Finite element analysis of electric field assisted bonding

James G. Boyd, Eniko T. Enikov

Research output: Contribution to journalConference article

Abstract

An anodic bond is modeled as a moving nonmaterial line forming the intersection of three material surfaces representing the unbonded conductor, the unbonded insulator, and the bonded interface. The component mass balance equations, Gauss' law, and the linear momentum equations are placed in a finite element formulation, which is used to predict the evolution of the sodium ion concentration, electric potential, and stress during anodic bonding of Pyrex glass and silicon.

Original languageEnglish (US)
Pages (from-to)306-318
Number of pages13
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3992
StatePublished - Jan 1 2000
Externally publishedYes
EventSmart Structures and Materials 2000 - Active Materials: Behavior and Mechanics - Newport Beach, CA, USA
Duration: Mar 6 2000Mar 9 2000

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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