Finite-element formulation for anodic bonding

Eniko T Enikov, James G. Boyd

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

An anodic bond is modeled as a moving non-material line forming the intersection of three material surfaces representing the unbonded conductor, the unbonded insulator, and the bonded interface. The component mass balance equations, Gauss' law, and the linear momentum equations are cast in a finite-element formulation, which is used to predict the evolution of the sodium ion concentration, electric potential, and stress during the anodic bonding of Pyrex glass and silicon. The method is applicable to the viscoplasticity of solid electrolytes, and the volume and interface free energies can be modified to model electromechanical interface phenomena such as debonding, space charge accumulation and sliding at grain boundaries in ionic crystals, and a cohesive zone theory of piezoelectric fracture.

Original languageEnglish (US)
Pages (from-to)737-750
Number of pages14
JournalSmart Materials and Structures
Volume9
Issue number6
DOIs
StatePublished - Dec 2000

Fingerprint

Viscoplasticity
Solid electrolytes
Debonding
Silicon
Electric space charge
Free energy
Momentum
Grain boundaries
Sodium
Ions
formulations
Glass
Crystals
Electric potential
viscoplasticity
ionic crystals
mass balance
borosilicate glass
solid electrolytes
ion concentration

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Finite-element formulation for anodic bonding. / Enikov, Eniko T; Boyd, James G.

In: Smart Materials and Structures, Vol. 9, No. 6, 12.2000, p. 737-750.

Research output: Contribution to journalArticle

Enikov, Eniko T ; Boyd, James G. / Finite-element formulation for anodic bonding. In: Smart Materials and Structures. 2000 ; Vol. 9, No. 6. pp. 737-750.
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