Formation of nanoporous Au by dealloying AuCu thin films in HNO3

R. Morrish, K. Dorame, Anthony J Muscat

Research output: Contribution to journalArticle

49 Citations (Scopus)

Abstract

AuCu thin films were dealloyed in concentrated HNO3 solution at temperatures of 5-35 °C. X-ray diffraction and scanning electron microscopy analysis showed that interior grain regions undergo partial Cu dissolution before being assimilated into a ligament/void network that was initiated at grain boundaries. The compressive stress generated by removal of the smaller Cu atom yielded an activation energy for ligament growth of 25.4 ± 2.37 kJ mol-1, which is less than half that reported for AgAu alloys.

Original languageEnglish (US)
Pages (from-to)856-859
Number of pages4
JournalScripta Materialia
Volume64
Issue number9
DOIs
StatePublished - May 2011

Fingerprint

ligaments
Ligaments
Thin films
thin films
Compressive stress
voids
dissolving
Dissolution
Grain boundaries
grain boundaries
Activation energy
activation energy
X ray diffraction
Atoms
Scanning electron microscopy
scanning electron microscopy
diffraction
atoms
x rays
Temperature

Keywords

  • Dealloy
  • Nanostructured material
  • Porous material
  • Surface diffusion
  • Thin films

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Formation of nanoporous Au by dealloying AuCu thin films in HNO3. / Morrish, R.; Dorame, K.; Muscat, Anthony J.

In: Scripta Materialia, Vol. 64, No. 9, 05.2011, p. 856-859.

Research output: Contribution to journalArticle

Morrish, R. ; Dorame, K. ; Muscat, Anthony J. / Formation of nanoporous Au by dealloying AuCu thin films in HNO3. In: Scripta Materialia. 2011 ; Vol. 64, No. 9. pp. 856-859.
@article{f77b76ec569b4d3fb8d9d9e86207efe4,
title = "Formation of nanoporous Au by dealloying AuCu thin films in HNO3",
abstract = "AuCu thin films were dealloyed in concentrated HNO3 solution at temperatures of 5-35 °C. X-ray diffraction and scanning electron microscopy analysis showed that interior grain regions undergo partial Cu dissolution before being assimilated into a ligament/void network that was initiated at grain boundaries. The compressive stress generated by removal of the smaller Cu atom yielded an activation energy for ligament growth of 25.4 ± 2.37 kJ mol-1, which is less than half that reported for AgAu alloys.",
keywords = "Dealloy, Nanostructured material, Porous material, Surface diffusion, Thin films",
author = "R. Morrish and K. Dorame and Muscat, {Anthony J}",
year = "2011",
month = "5",
doi = "10.1016/j.scriptamat.2011.01.021",
language = "English (US)",
volume = "64",
pages = "856--859",
journal = "Scripta Materialia",
issn = "1359-6462",
publisher = "Elsevier Limited",
number = "9",

}

TY - JOUR

T1 - Formation of nanoporous Au by dealloying AuCu thin films in HNO3

AU - Morrish, R.

AU - Dorame, K.

AU - Muscat, Anthony J

PY - 2011/5

Y1 - 2011/5

N2 - AuCu thin films were dealloyed in concentrated HNO3 solution at temperatures of 5-35 °C. X-ray diffraction and scanning electron microscopy analysis showed that interior grain regions undergo partial Cu dissolution before being assimilated into a ligament/void network that was initiated at grain boundaries. The compressive stress generated by removal of the smaller Cu atom yielded an activation energy for ligament growth of 25.4 ± 2.37 kJ mol-1, which is less than half that reported for AgAu alloys.

AB - AuCu thin films were dealloyed in concentrated HNO3 solution at temperatures of 5-35 °C. X-ray diffraction and scanning electron microscopy analysis showed that interior grain regions undergo partial Cu dissolution before being assimilated into a ligament/void network that was initiated at grain boundaries. The compressive stress generated by removal of the smaller Cu atom yielded an activation energy for ligament growth of 25.4 ± 2.37 kJ mol-1, which is less than half that reported for AgAu alloys.

KW - Dealloy

KW - Nanostructured material

KW - Porous material

KW - Surface diffusion

KW - Thin films

UR - http://www.scopus.com/inward/record.url?scp=79952190429&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=79952190429&partnerID=8YFLogxK

U2 - 10.1016/j.scriptamat.2011.01.021

DO - 10.1016/j.scriptamat.2011.01.021

M3 - Article

AN - SCOPUS:79952190429

VL - 64

SP - 856

EP - 859

JO - Scripta Materialia

JF - Scripta Materialia

SN - 1359-6462

IS - 9

ER -