Tribological attributes of a post-chemical mechanical planarization (CMP) brush-scrubbing process are investigated as a function of brush surface design and wafer substrate topography. Two types of brushes with different surface designs are tested on both silicon dioxide blanket wafer and shallow trench isolation patterned wafer substrates. Results show that brush design strongly impacts the frictional and lubrication characteristics of the scrubbing process, which suggests the need for customized brush surface designs for improved cleaning efficiency.
ASJC Scopus subject areas
- Chemical Engineering(all)
- Materials Science(all)
- Physical and Theoretical Chemistry
- Electrical and Electronic Engineering