Frictional analysis of various poly(vinyl alcohol) brush roller designs for post-interlevel dielectric cmp scrubbing applications

Research output: Contribution to journalArticle

14 Scopus citations

Abstract

Tribological attributes of a post-chemical mechanical planarization (CMP) brush-scrubbing process are investigated as a function of brush surface design and wafer substrate topography. Two types of brushes with different surface designs are tested on both silicon dioxide blanket wafer and shallow trench isolation patterned wafer substrates. Results show that brush design strongly impacts the frictional and lubrication characteristics of the scrubbing process, which suggests the need for customized brush surface designs for improved cleaning efficiency.

Original languageEnglish (US)
Pages (from-to)H84-H87
JournalElectrochemical and Solid-State Letters
Volume12
Issue number3
DOIs
StatePublished - Jan 19 2009

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Materials Science(all)
  • Physical and Theoretical Chemistry
  • Electrochemistry
  • Electrical and Electronic Engineering

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