Frictional analysis of various poly(vinyl alcohol) brush roller designs for post-interlevel dielectric cmp scrubbing applications

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

Tribological attributes of a post-chemical mechanical planarization (CMP) brush-scrubbing process are investigated as a function of brush surface design and wafer substrate topography. Two types of brushes with different surface designs are tested on both silicon dioxide blanket wafer and shallow trench isolation patterned wafer substrates. Results show that brush design strongly impacts the frictional and lubrication characteristics of the scrubbing process, which suggests the need for customized brush surface designs for improved cleaning efficiency.

Original languageEnglish (US)
JournalElectrochemical and Solid-State Letters
Volume12
Issue number3
DOIs
StatePublished - 2009

Fingerprint

rollers
washing
brushes
Brushes
alcohols
Alcohols
wafers
Chemical mechanical polishing
blankets
Substrates
lubrication
Silicon Dioxide
Topography
cleaning
Lubrication
Cleaning
isolation
topography
Silica
silicon dioxide

ASJC Scopus subject areas

  • Electrochemistry
  • Electrical and Electronic Engineering
  • Materials Science(all)
  • Chemical Engineering(all)
  • Physical and Theoretical Chemistry

Cite this

@article{b3784cb19a0542048f5d01b35a911e2f,
title = "Frictional analysis of various poly(vinyl alcohol) brush roller designs for post-interlevel dielectric cmp scrubbing applications",
abstract = "Tribological attributes of a post-chemical mechanical planarization (CMP) brush-scrubbing process are investigated as a function of brush surface design and wafer substrate topography. Two types of brushes with different surface designs are tested on both silicon dioxide blanket wafer and shallow trench isolation patterned wafer substrates. Results show that brush design strongly impacts the frictional and lubrication characteristics of the scrubbing process, which suggests the need for customized brush surface designs for improved cleaning efficiency.",
author = "Ara Philipossian and T. Sun",
year = "2009",
doi = "10.1149/1.3058994",
language = "English (US)",
volume = "12",
journal = "Electrochemical and Solid-State Letters",
issn = "1099-0062",
publisher = "Electrochemical Society, Inc.",
number = "3",

}

TY - JOUR

T1 - Frictional analysis of various poly(vinyl alcohol) brush roller designs for post-interlevel dielectric cmp scrubbing applications

AU - Philipossian, Ara

AU - Sun, T.

PY - 2009

Y1 - 2009

N2 - Tribological attributes of a post-chemical mechanical planarization (CMP) brush-scrubbing process are investigated as a function of brush surface design and wafer substrate topography. Two types of brushes with different surface designs are tested on both silicon dioxide blanket wafer and shallow trench isolation patterned wafer substrates. Results show that brush design strongly impacts the frictional and lubrication characteristics of the scrubbing process, which suggests the need for customized brush surface designs for improved cleaning efficiency.

AB - Tribological attributes of a post-chemical mechanical planarization (CMP) brush-scrubbing process are investigated as a function of brush surface design and wafer substrate topography. Two types of brushes with different surface designs are tested on both silicon dioxide blanket wafer and shallow trench isolation patterned wafer substrates. Results show that brush design strongly impacts the frictional and lubrication characteristics of the scrubbing process, which suggests the need for customized brush surface designs for improved cleaning efficiency.

UR - http://www.scopus.com/inward/record.url?scp=58149489123&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=58149489123&partnerID=8YFLogxK

U2 - 10.1149/1.3058994

DO - 10.1149/1.3058994

M3 - Article

VL - 12

JO - Electrochemical and Solid-State Letters

JF - Electrochemical and Solid-State Letters

SN - 1099-0062

IS - 3

ER -