FUMED CERIA for use in ILD and STI CMP

M. Kröll, W. Lortz, R. Brandes, N. J. Piscataway, Ara Philipossian

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Apart from its hydrothermal Ceria Degussa has now developed a novel fumed Ceria which can be used in STI and ILD CMP. By controlling process parameters of the gas-phase synthesis the nature of the material can be adjusted. Parameters, such as precursor concentration, temperature, cooling rate or residence time in the reactor directly influence material properties, e.g. the BET surface area, the particle size and the particle morphology. When used as an abrasive the properties of the particles have significant effects on the removal rate or the coefficient of friction in CMP. Thus, by carefully choosing the most suitable process parameters during the particle genesis a material with a high removal rate or high selectivity in CMP applications can be generated. Degussa has produced different types of Ceria with different BET surface area or different morphology and tested them in silica and silicon nitride polishing. Ideal polishing conditions are determined as a function of the BET surface area and pH value.

Original languageEnglish (US)
Title of host publication2005 Proceedings - 10th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2005
Pages366-373
Number of pages8
StatePublished - 2005
Event10th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2005 - Fremont, CA, United States
Duration: Feb 23 2005Feb 25 2005

Other

Other10th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2005
CountryUnited States
CityFremont, CA
Period2/23/052/25/05

Fingerprint

Cerium compounds
Polishing
Silicon nitride
Abrasives
Materials properties
Particle size
Silica
Friction
Cooling
Gases
Temperature

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Kröll, M., Lortz, W., Brandes, R., Piscataway, N. J., & Philipossian, A. (2005). FUMED CERIA for use in ILD and STI CMP. In 2005 Proceedings - 10th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2005 (pp. 366-373)

FUMED CERIA for use in ILD and STI CMP. / Kröll, M.; Lortz, W.; Brandes, R.; Piscataway, N. J.; Philipossian, Ara.

2005 Proceedings - 10th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2005. 2005. p. 366-373.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kröll, M, Lortz, W, Brandes, R, Piscataway, NJ & Philipossian, A 2005, FUMED CERIA for use in ILD and STI CMP. in 2005 Proceedings - 10th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2005. pp. 366-373, 10th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2005, Fremont, CA, United States, 2/23/05.
Kröll M, Lortz W, Brandes R, Piscataway NJ, Philipossian A. FUMED CERIA for use in ILD and STI CMP. In 2005 Proceedings - 10th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2005. 2005. p. 366-373
Kröll, M. ; Lortz, W. ; Brandes, R. ; Piscataway, N. J. ; Philipossian, Ara. / FUMED CERIA for use in ILD and STI CMP. 2005 Proceedings - 10th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2005. 2005. pp. 366-373
@inproceedings{db06ff3d6dc247e2bea1a2f2805a5545,
title = "FUMED CERIA for use in ILD and STI CMP",
abstract = "Apart from its hydrothermal Ceria Degussa has now developed a novel fumed Ceria which can be used in STI and ILD CMP. By controlling process parameters of the gas-phase synthesis the nature of the material can be adjusted. Parameters, such as precursor concentration, temperature, cooling rate or residence time in the reactor directly influence material properties, e.g. the BET surface area, the particle size and the particle morphology. When used as an abrasive the properties of the particles have significant effects on the removal rate or the coefficient of friction in CMP. Thus, by carefully choosing the most suitable process parameters during the particle genesis a material with a high removal rate or high selectivity in CMP applications can be generated. Degussa has produced different types of Ceria with different BET surface area or different morphology and tested them in silica and silicon nitride polishing. Ideal polishing conditions are determined as a function of the BET surface area and pH value.",
author = "M. Kr{\"o}ll and W. Lortz and R. Brandes and Piscataway, {N. J.} and Ara Philipossian",
year = "2005",
language = "English (US)",
pages = "366--373",
booktitle = "2005 Proceedings - 10th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2005",

}

TY - GEN

T1 - FUMED CERIA for use in ILD and STI CMP

AU - Kröll, M.

AU - Lortz, W.

AU - Brandes, R.

AU - Piscataway, N. J.

AU - Philipossian, Ara

PY - 2005

Y1 - 2005

N2 - Apart from its hydrothermal Ceria Degussa has now developed a novel fumed Ceria which can be used in STI and ILD CMP. By controlling process parameters of the gas-phase synthesis the nature of the material can be adjusted. Parameters, such as precursor concentration, temperature, cooling rate or residence time in the reactor directly influence material properties, e.g. the BET surface area, the particle size and the particle morphology. When used as an abrasive the properties of the particles have significant effects on the removal rate or the coefficient of friction in CMP. Thus, by carefully choosing the most suitable process parameters during the particle genesis a material with a high removal rate or high selectivity in CMP applications can be generated. Degussa has produced different types of Ceria with different BET surface area or different morphology and tested them in silica and silicon nitride polishing. Ideal polishing conditions are determined as a function of the BET surface area and pH value.

AB - Apart from its hydrothermal Ceria Degussa has now developed a novel fumed Ceria which can be used in STI and ILD CMP. By controlling process parameters of the gas-phase synthesis the nature of the material can be adjusted. Parameters, such as precursor concentration, temperature, cooling rate or residence time in the reactor directly influence material properties, e.g. the BET surface area, the particle size and the particle morphology. When used as an abrasive the properties of the particles have significant effects on the removal rate or the coefficient of friction in CMP. Thus, by carefully choosing the most suitable process parameters during the particle genesis a material with a high removal rate or high selectivity in CMP applications can be generated. Degussa has produced different types of Ceria with different BET surface area or different morphology and tested them in silica and silicon nitride polishing. Ideal polishing conditions are determined as a function of the BET surface area and pH value.

UR - http://www.scopus.com/inward/record.url?scp=84888264957&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84888264957&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:84888264957

SP - 366

EP - 373

BT - 2005 Proceedings - 10th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2005

ER -