Fundamentals of wafer rinse processes and the interactions with water conservation and recycling in semiconductor manufacturing plants

F. Shadman, D. Seif, T. Peterson

Research output: Contribution to journalConference article

Abstract

A study was conducted to directly measure the rate of rinse process and chemical removal from structures on typical patterned waters. Results indicate that the reduction of water usage during rise needs to be optimized to achieve the best results for the overall water and energy conservation strategy.

Original languageEnglish (US)
Pages (from-to)189-190
Number of pages2
JournalDiffusion and Defect Data Pt.B: Solid State Phenomena
Volume76-77
StatePublished - Dec 1 2000
Event5th Internatinal Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS 2000) - Ostend, Belgium
Duration: Sep 18 2000Sep 20 2000

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Materials Science(all)
  • Condensed Matter Physics
  • Physics and Astronomy (miscellaneous)

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