Fundamentals of wafer rinse processes and the interactions with water conservation and recycling in semiconductor manufacturing plants

Farhang Shadman, D. Seif, T. Peterson

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

A study was conducted to directly measure the rate of rinse process and chemical removal from structures on typical patterned waters. Results indicate that the reduction of water usage during rise needs to be optimized to achieve the best results for the overall water and energy conservation strategy.

Original languageEnglish (US)
Title of host publicationDiffusion and Defect Data Pt.B: Solid State Phenomena
PublisherScitec Publications Ltd.
Pages189-190
Number of pages2
Volume76-77
StatePublished - 2000
Event5th Internatinal Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS 2000) - Ostend, Belgium
Duration: Sep 18 2000Sep 20 2000

Other

Other5th Internatinal Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS 2000)
CityOstend, Belgium
Period9/18/009/20/00

Fingerprint

Water recycling
Water conservation
Beam plasma interactions
recycling
Chemicals removal (water treatment)
conservation
manufacturing
wafers
Semiconductor materials
Water
water
Energy conservation
energy conservation
interactions

ASJC Scopus subject areas

  • Materials Science(all)
  • Electronic, Optical and Magnetic Materials
  • Physics and Astronomy (miscellaneous)
  • Condensed Matter Physics

Cite this

Shadman, F., Seif, D., & Peterson, T. (2000). Fundamentals of wafer rinse processes and the interactions with water conservation and recycling in semiconductor manufacturing plants. In Diffusion and Defect Data Pt.B: Solid State Phenomena (Vol. 76-77, pp. 189-190). Scitec Publications Ltd..

Fundamentals of wafer rinse processes and the interactions with water conservation and recycling in semiconductor manufacturing plants. / Shadman, Farhang; Seif, D.; Peterson, T.

Diffusion and Defect Data Pt.B: Solid State Phenomena. Vol. 76-77 Scitec Publications Ltd., 2000. p. 189-190.

Research output: Chapter in Book/Report/Conference proceedingChapter

Shadman, F, Seif, D & Peterson, T 2000, Fundamentals of wafer rinse processes and the interactions with water conservation and recycling in semiconductor manufacturing plants. in Diffusion and Defect Data Pt.B: Solid State Phenomena. vol. 76-77, Scitec Publications Ltd., pp. 189-190, 5th Internatinal Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS 2000), Ostend, Belgium, 9/18/00.
Shadman F, Seif D, Peterson T. Fundamentals of wafer rinse processes and the interactions with water conservation and recycling in semiconductor manufacturing plants. In Diffusion and Defect Data Pt.B: Solid State Phenomena. Vol. 76-77. Scitec Publications Ltd. 2000. p. 189-190
Shadman, Farhang ; Seif, D. ; Peterson, T. / Fundamentals of wafer rinse processes and the interactions with water conservation and recycling in semiconductor manufacturing plants. Diffusion and Defect Data Pt.B: Solid State Phenomena. Vol. 76-77 Scitec Publications Ltd., 2000. pp. 189-190
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