Fundamentals of wafer rinse processes and the interactions with water conservation and recycling in semiconductor manufacturing plants

F. Shadman, D. Seif, T. Peterson

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Production and distribution of ultra-pure water (UPW) in semiconductor manufacturing plants has significant environmental and economic impact. Most of the UPW is used for wafer rinsing. In recent years two strategies have been used to lower water usage in fabs: one is the minimization of rinse water usage by more efficient rinse tools and techniques; the other is the reuse and/or recycle of water recovered from various applications, particularly from the final stages of rinse. The implementation of these methods with minimum contamination risk requires better understanding of the fundamentals of the rinse process, the dynamics of the rate limiting step(s), and the interactions between rinse and recycle.

Original languageEnglish (US)
Title of host publicationUltra Clean Processing of Silicon Surfaces 2000
EditorsMarc Heyns, Paul Mertens, Marc Meuris
PublisherTrans Tech Publications Ltd
Pages189-190
Number of pages2
ISBN (Print)9783908450573
DOIs
StatePublished - 2001
Event5th International Symposium on Ultra Clean Processing of Silicon Surfaces, UCPSS 2000 - Ostend, Belgium
Duration: Sep 18 2000Sep 20 2000

Publication series

NameSolid State Phenomena
Volume76-77
ISSN (Print)1012-0394
ISSN (Electronic)1662-9779

Other

Other5th International Symposium on Ultra Clean Processing of Silicon Surfaces, UCPSS 2000
CountryBelgium
CityOstend
Period9/18/009/20/00

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics

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    Shadman, F., Seif, D., & Peterson, T. (2001). Fundamentals of wafer rinse processes and the interactions with water conservation and recycling in semiconductor manufacturing plants. In M. Heyns, P. Mertens, & M. Meuris (Eds.), Ultra Clean Processing of Silicon Surfaces 2000 (pp. 189-190). (Solid State Phenomena; Vol. 76-77). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/SSP.76-77.189