Global/local finite element analysis for singular stress fields near the junction of dissimilar elastic and elastic-plastic materials in electronic packages

Research output: Contribution to journalConference article

12 Scopus citations

Abstract

The global/local finite element method was extended to include elastic and/or plastic deformation. A global element stiffness matrix was constructed based on the analytical solution for a singular stress field near a junction of dissimilar materials with elastic and elastic-plastic behaviors. It was found that considering only the order of the singularity in predicting the failure site is not sufficient.

Original languageEnglish (US)
Pages (from-to)987-993
Number of pages7
JournalProceedings - Electronic Components and Technology Conference
StatePublished - Jan 1 1999
EventProceedings of the 1999 49th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA
Duration: Jun 1 1999Jun 4 1999

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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