Global/local finite element analysis for singular stress fields near the junction of dissimilar elastic and elastic-plastic materials in electronic packages

Research output: Contribution to journalConference article

12 Scopus citations

Fingerprint Dive into the research topics of 'Global/local finite element analysis for singular stress fields near the junction of dissimilar elastic and elastic-plastic materials in electronic packages'. Together they form a unique fingerprint.

Chemical Compounds

Engineering & Materials Science