Heat transfer in a microchannel flow [substrate cooling]

W. K.H. Chu, U. T. Hsu, M. Wong, Yitshak Zohar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

The field of MicroElectroMechanical Systems (MEMS) is expanding rapidly. It is becoming feasible to integrate complete microsystems by merging mechanical, electrical, thermal, optical and perhaps chemical components. Utilizing surface micromachining techniques, a large number of small-size, high-precision channels can be constructed as part of microcooling systems. The experimental setup proposed for the study of heat transfer characteristics of such microchannel flow is described in the first part of the paper. In the second part, initial results of a theoretical investigation of heat removal from a substrate by microchannel flow are presented.

Original languageEnglish (US)
Title of host publicationProceedings - 1994 IEEE Hong Kong Electron Devices Meeting, HKEDM 1994
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages38-43
Number of pages6
ISBN (Electronic)0780320867, 9780780320864
DOIs
Publication statusPublished - Jan 1 1994
Externally publishedYes
Event1994 IEEE Hong Kong Electron Devices Meeting, HKEDM 1994 - Hong Kong, Hong Kong
Duration: Jul 18 1994 → …

Publication series

NameProceedings - 1994 IEEE Hong Kong Electron Devices Meeting, HKEDM 1994

Conference

Conference1994 IEEE Hong Kong Electron Devices Meeting, HKEDM 1994
CountryHong Kong
CityHong Kong
Period7/18/94 → …

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Instrumentation

Cite this

Chu, W. K. H., Hsu, U. T., Wong, M., & Zohar, Y. (1994). Heat transfer in a microchannel flow [substrate cooling]. In Proceedings - 1994 IEEE Hong Kong Electron Devices Meeting, HKEDM 1994 (pp. 38-43). [395134] (Proceedings - 1994 IEEE Hong Kong Electron Devices Meeting, HKEDM 1994). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/HKEDM.1994.395134