High contrast and metal-less alignment process for all-polymer optical interconnect devices

Tao Ge, Jilin Yang, Chris Summitt, Sunglin Wang, Lee Johnson, Melissa Zaverton, Thomas D Milster, Yuzuru Takashima

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A polymer-based flat, flexible and parallel optical interconnect has become an attractive approach for short-range data transfer. For such a device, a low cost fabrication technique is required for light couplers to redirect light from source to waveguides. Recently, we demonstrated a mask-less gray scale lithography process, which used a CMOS compatible polymer for a 45-degree mirror coupler. Polymer materials such as epoclad and AP2210B can be used to fabricate flexible substrates and waveguides, respectively. We propose an all-photopolymer lithography process to fabricate the flexible and parallel optical interconnect in conjunction with the mirror couplers. In the process, a buried polymer structure is used to precisely align the mirror coupler to waveguides, which make it possible to avoid an additional metallization process. However, the contrast of such buried fiducial mark is low since such the structure is a phase structure. As a result, it is not feasible to use the buried polymer structure as an alignment mark with conventional amplitude based imaging modalities. To increase the contrast of these buried alignment marks, we propose a feature specific alignment system for which the shape and depth of the buried alignment marks are optimized for phase-based imaging such as phase contrast and Schlieren imaging. Our results show that an optimized alignment mark provides a significant contrast enhancement while using a phase contrast imaging system compared to that of a conventional imaging system. In addition, we have fabricated an optimized alignment mark specifically for use with a Schlieren imaging system.

Original languageEnglish (US)
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
PublisherSPIE
Volume9374
ISBN (Print)9781628414646
DOIs
StatePublished - 2015
EventAdvanced Fabrication Technologies for Micro/Nano Optics and Photonics VIII - San Francisco, United States
Duration: Feb 8 2015Feb 11 2015

Other

OtherAdvanced Fabrication Technologies for Micro/Nano Optics and Photonics VIII
CountryUnited States
CitySan Francisco
Period2/8/152/11/15

Fingerprint

Optical Interconnects
optical interconnects
Optical interconnects
Polymers
Alignment
Metals
alignment
Coupler
couplers
polymers
Imaging System
Imaging systems
metals
Waveguide
Phase Contrast
Mirror
Mirrors
Waveguides
Imaging
phase contrast

Keywords

  • 45-degree mirror coupler
  • lithography
  • optical interconnect
  • phase contrast imaging
  • phase-based alignment marks
  • Schlieren imaging

ASJC Scopus subject areas

  • Applied Mathematics
  • Computer Science Applications
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

Ge, T., Yang, J., Summitt, C., Wang, S., Johnson, L., Zaverton, M., ... Takashima, Y. (2015). High contrast and metal-less alignment process for all-polymer optical interconnect devices. In Proceedings of SPIE - The International Society for Optical Engineering (Vol. 9374). [93741F] SPIE. https://doi.org/10.1117/12.2079620

High contrast and metal-less alignment process for all-polymer optical interconnect devices. / Ge, Tao; Yang, Jilin; Summitt, Chris; Wang, Sunglin; Johnson, Lee; Zaverton, Melissa; Milster, Thomas D; Takashima, Yuzuru.

Proceedings of SPIE - The International Society for Optical Engineering. Vol. 9374 SPIE, 2015. 93741F.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ge, T, Yang, J, Summitt, C, Wang, S, Johnson, L, Zaverton, M, Milster, TD & Takashima, Y 2015, High contrast and metal-less alignment process for all-polymer optical interconnect devices. in Proceedings of SPIE - The International Society for Optical Engineering. vol. 9374, 93741F, SPIE, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics VIII, San Francisco, United States, 2/8/15. https://doi.org/10.1117/12.2079620
Ge T, Yang J, Summitt C, Wang S, Johnson L, Zaverton M et al. High contrast and metal-less alignment process for all-polymer optical interconnect devices. In Proceedings of SPIE - The International Society for Optical Engineering. Vol. 9374. SPIE. 2015. 93741F https://doi.org/10.1117/12.2079620
Ge, Tao ; Yang, Jilin ; Summitt, Chris ; Wang, Sunglin ; Johnson, Lee ; Zaverton, Melissa ; Milster, Thomas D ; Takashima, Yuzuru. / High contrast and metal-less alignment process for all-polymer optical interconnect devices. Proceedings of SPIE - The International Society for Optical Engineering. Vol. 9374 SPIE, 2015.
@inproceedings{c9385b6ba65b487c817140bbd6a3f14f,
title = "High contrast and metal-less alignment process for all-polymer optical interconnect devices",
abstract = "A polymer-based flat, flexible and parallel optical interconnect has become an attractive approach for short-range data transfer. For such a device, a low cost fabrication technique is required for light couplers to redirect light from source to waveguides. Recently, we demonstrated a mask-less gray scale lithography process, which used a CMOS compatible polymer for a 45-degree mirror coupler. Polymer materials such as epoclad and AP2210B can be used to fabricate flexible substrates and waveguides, respectively. We propose an all-photopolymer lithography process to fabricate the flexible and parallel optical interconnect in conjunction with the mirror couplers. In the process, a buried polymer structure is used to precisely align the mirror coupler to waveguides, which make it possible to avoid an additional metallization process. However, the contrast of such buried fiducial mark is low since such the structure is a phase structure. As a result, it is not feasible to use the buried polymer structure as an alignment mark with conventional amplitude based imaging modalities. To increase the contrast of these buried alignment marks, we propose a feature specific alignment system for which the shape and depth of the buried alignment marks are optimized for phase-based imaging such as phase contrast and Schlieren imaging. Our results show that an optimized alignment mark provides a significant contrast enhancement while using a phase contrast imaging system compared to that of a conventional imaging system. In addition, we have fabricated an optimized alignment mark specifically for use with a Schlieren imaging system.",
keywords = "45-degree mirror coupler, lithography, optical interconnect, phase contrast imaging, phase-based alignment marks, Schlieren imaging",
author = "Tao Ge and Jilin Yang and Chris Summitt and Sunglin Wang and Lee Johnson and Melissa Zaverton and Milster, {Thomas D} and Yuzuru Takashima",
year = "2015",
doi = "10.1117/12.2079620",
language = "English (US)",
isbn = "9781628414646",
volume = "9374",
booktitle = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "SPIE",

}

TY - GEN

T1 - High contrast and metal-less alignment process for all-polymer optical interconnect devices

AU - Ge, Tao

AU - Yang, Jilin

AU - Summitt, Chris

AU - Wang, Sunglin

AU - Johnson, Lee

AU - Zaverton, Melissa

AU - Milster, Thomas D

AU - Takashima, Yuzuru

PY - 2015

Y1 - 2015

N2 - A polymer-based flat, flexible and parallel optical interconnect has become an attractive approach for short-range data transfer. For such a device, a low cost fabrication technique is required for light couplers to redirect light from source to waveguides. Recently, we demonstrated a mask-less gray scale lithography process, which used a CMOS compatible polymer for a 45-degree mirror coupler. Polymer materials such as epoclad and AP2210B can be used to fabricate flexible substrates and waveguides, respectively. We propose an all-photopolymer lithography process to fabricate the flexible and parallel optical interconnect in conjunction with the mirror couplers. In the process, a buried polymer structure is used to precisely align the mirror coupler to waveguides, which make it possible to avoid an additional metallization process. However, the contrast of such buried fiducial mark is low since such the structure is a phase structure. As a result, it is not feasible to use the buried polymer structure as an alignment mark with conventional amplitude based imaging modalities. To increase the contrast of these buried alignment marks, we propose a feature specific alignment system for which the shape and depth of the buried alignment marks are optimized for phase-based imaging such as phase contrast and Schlieren imaging. Our results show that an optimized alignment mark provides a significant contrast enhancement while using a phase contrast imaging system compared to that of a conventional imaging system. In addition, we have fabricated an optimized alignment mark specifically for use with a Schlieren imaging system.

AB - A polymer-based flat, flexible and parallel optical interconnect has become an attractive approach for short-range data transfer. For such a device, a low cost fabrication technique is required for light couplers to redirect light from source to waveguides. Recently, we demonstrated a mask-less gray scale lithography process, which used a CMOS compatible polymer for a 45-degree mirror coupler. Polymer materials such as epoclad and AP2210B can be used to fabricate flexible substrates and waveguides, respectively. We propose an all-photopolymer lithography process to fabricate the flexible and parallel optical interconnect in conjunction with the mirror couplers. In the process, a buried polymer structure is used to precisely align the mirror coupler to waveguides, which make it possible to avoid an additional metallization process. However, the contrast of such buried fiducial mark is low since such the structure is a phase structure. As a result, it is not feasible to use the buried polymer structure as an alignment mark with conventional amplitude based imaging modalities. To increase the contrast of these buried alignment marks, we propose a feature specific alignment system for which the shape and depth of the buried alignment marks are optimized for phase-based imaging such as phase contrast and Schlieren imaging. Our results show that an optimized alignment mark provides a significant contrast enhancement while using a phase contrast imaging system compared to that of a conventional imaging system. In addition, we have fabricated an optimized alignment mark specifically for use with a Schlieren imaging system.

KW - 45-degree mirror coupler

KW - lithography

KW - optical interconnect

KW - phase contrast imaging

KW - phase-based alignment marks

KW - Schlieren imaging

UR - http://www.scopus.com/inward/record.url?scp=84930260504&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84930260504&partnerID=8YFLogxK

U2 - 10.1117/12.2079620

DO - 10.1117/12.2079620

M3 - Conference contribution

AN - SCOPUS:84930260504

SN - 9781628414646

VL - 9374

BT - Proceedings of SPIE - The International Society for Optical Engineering

PB - SPIE

ER -