High resolution semiconductor inspection by using solid immersion lenses

Jun Zhang, Yullin Kim, Youngsik Kim, Roberto Valencia, Tom D. Milster, Dave Dozer

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

A near-field subsurface (100 μm) microscope with numerical aperture (NA) = 2:45 is developed for integrated circuit (IC) inspection by using silicon solid immersion lenses (SIL). It is optimized for imaging patterns underneath the surface (around 100 μm deep). With the illumination light at 1.2 μm, a lateral resolution of better than 300nm is experimentally demonstrated. Gap control and tilt servos are suggested for the possibility of dynamic imaging.

Original languageEnglish (US)
Article number03A043
JournalJapanese Journal of Applied Physics
Volume48
Issue number3 PART 2
DOIs
StatePublished - Mar 1 2009

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

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