Abstract
We demonstrate a low thermal impedance hybrid mirror VECSEL. We used only 14 pairs of AlGaAs/AlAs, transparent at the pump wavelength, and we used a patterned mask to deposit pure gold on areas of the chip to be pumped, and Ti/Au on other area to circumvent the poor adhesion of gold on GaAs. A higher gain is observed on an area metallized with pure gold and an output power of 4W was obtained, showing the effectiveness of the metallic mirror and validating the bonding quality. Chip processing and laser characteristics are studied in detail and compared to simulations.
Original language | English (US) |
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Title of host publication | Vertical External Cavity Surface Emitting Lasers (VECSELs) VI |
Publisher | SPIE |
Volume | 9734 |
ISBN (Electronic) | 9781628419696 |
DOIs | |
State | Published - 2016 |
Event | Vertical External Cavity Surface Emitting Lasers (VECSELs) VI - San Francisco, United States Duration: Feb 15 2016 → Feb 16 2016 |
Other
Other | Vertical External Cavity Surface Emitting Lasers (VECSELs) VI |
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Country | United States |
City | San Francisco |
Period | 2/15/16 → 2/16/16 |
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Keywords
- DBR
- high power
- hybrid mirror
- lithography
- OPSL
- semiconductor
- VECSEL
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering
Cite this
Hybrid metal-semiconductor mirror for high power VECSEL. / Laurain, Alexandre; Gbele, Kokou; Hader, Jorg; Stolz, Wolfgang; Koch, Stephan W; Ruiz Perez, Antje; Moloney, Jerome V.
Vertical External Cavity Surface Emitting Lasers (VECSELs) VI. Vol. 9734 SPIE, 2016. 973415.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Hybrid metal-semiconductor mirror for high power VECSEL
AU - Laurain, Alexandre
AU - Gbele, Kokou
AU - Hader, Jorg
AU - Stolz, Wolfgang
AU - Koch, Stephan W
AU - Ruiz Perez, Antje
AU - Moloney, Jerome V
PY - 2016
Y1 - 2016
N2 - We demonstrate a low thermal impedance hybrid mirror VECSEL. We used only 14 pairs of AlGaAs/AlAs, transparent at the pump wavelength, and we used a patterned mask to deposit pure gold on areas of the chip to be pumped, and Ti/Au on other area to circumvent the poor adhesion of gold on GaAs. A higher gain is observed on an area metallized with pure gold and an output power of 4W was obtained, showing the effectiveness of the metallic mirror and validating the bonding quality. Chip processing and laser characteristics are studied in detail and compared to simulations.
AB - We demonstrate a low thermal impedance hybrid mirror VECSEL. We used only 14 pairs of AlGaAs/AlAs, transparent at the pump wavelength, and we used a patterned mask to deposit pure gold on areas of the chip to be pumped, and Ti/Au on other area to circumvent the poor adhesion of gold on GaAs. A higher gain is observed on an area metallized with pure gold and an output power of 4W was obtained, showing the effectiveness of the metallic mirror and validating the bonding quality. Chip processing and laser characteristics are studied in detail and compared to simulations.
KW - DBR
KW - high power
KW - hybrid mirror
KW - lithography
KW - OPSL
KW - semiconductor
KW - VECSEL
UR - http://www.scopus.com/inward/record.url?scp=84981243952&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84981243952&partnerID=8YFLogxK
U2 - 10.1117/12.2212937
DO - 10.1117/12.2212937
M3 - Conference contribution
AN - SCOPUS:84981243952
VL - 9734
BT - Vertical External Cavity Surface Emitting Lasers (VECSELs) VI
PB - SPIE
ER -