Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics

Selda Oterkus, Erdogan Madenci, Erkan Oterkus, Yuchul Hwang, Jangyong Bae, Sungwon Han

Research output: Chapter in Book/Report/Conference proceedingConference contribution

36 Scopus citations

Abstract

This study presents an integrated approach for the simulation of hygro-thermo-vapor-deformation analysis of electronic packages by using peridynamics. This theory is suitable for such analysis because of its mathematical structure. Its governing equation is an integro-differential equation and it is valid regardless of the existence of material and geometric discontinuities in the structure. It permits the specification of distinct properties of interfaces between dissimilar materials in the direct modeling of thermal and moisture diffusion, and deformation. Therefore, it enables progressive damage analysis in materials or layered material systems such as the electronic packages. It describes the validation procedure by considering a particular package for each thermomechanical, hygromechanical deformation as well as vapor pressure predictions. Also, it presents results concerning failure sites and mechanisms due to hygro-thermo-vapor-deformation.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages973-982
Number of pages10
ISBN (Electronic)9781479924073
DOIs
StatePublished - Sep 11 2014
Event64th Electronic Components and Technology Conference, ECTC 2014 - Orlando, United States
Duration: May 27 2014May 30 2014

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other64th Electronic Components and Technology Conference, ECTC 2014
CountryUnited States
CityOrlando
Period5/27/145/30/14

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics'. Together they form a unique fingerprint.

Cite this