Impact of geometry of embedded pattern layer on signal integrity of coupled microstrips

Marcos A. Vargas, Kathleen L Melde

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

In this paper, the interconnect performance of closely spaced microstrip lines with embedded patterned layers (EPL) are presented. The EPL is an added patterned layer of printed sub wavelength elements that is placed between the ground and signal layers of the microstrip. A comparison of the performance of the microstrips with various EPL geometries is conducted. A study of the pattern density and the shape of the EPL patterns on insertion loss, return loss, and far-end cross talk (FEXT) is provided. The purpose of this work is to evaluate how the EPL geometry can be optimized to improve signal integrity in tightly spaced interconnects.

Original languageEnglish (US)
Title of host publication2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages121-124
Number of pages4
ISBN (Print)9781479936410
DOIs
StatePublished - May 7 2015
Event23rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014 - Portland, United States
Duration: Oct 26 2014Oct 29 2014

Other

Other23rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014
CountryUnited States
CityPortland
Period10/26/1410/29/14

Fingerprint

Geometry
Microstrip lines
Insertion losses
Wavelength

Keywords

  • Crosstalk
  • insertion loss
  • interconnects
  • microstrip

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Vargas, M. A., & Melde, K. L. (2015). Impact of geometry of embedded pattern layer on signal integrity of coupled microstrips. In 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014 (pp. 121-124). [7103611] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEPS.2014.7103611

Impact of geometry of embedded pattern layer on signal integrity of coupled microstrips. / Vargas, Marcos A.; Melde, Kathleen L.

2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014. Institute of Electrical and Electronics Engineers Inc., 2015. p. 121-124 7103611.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Vargas, MA & Melde, KL 2015, Impact of geometry of embedded pattern layer on signal integrity of coupled microstrips. in 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014., 7103611, Institute of Electrical and Electronics Engineers Inc., pp. 121-124, 23rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014, Portland, United States, 10/26/14. https://doi.org/10.1109/EPEPS.2014.7103611
Vargas MA, Melde KL. Impact of geometry of embedded pattern layer on signal integrity of coupled microstrips. In 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014. Institute of Electrical and Electronics Engineers Inc. 2015. p. 121-124. 7103611 https://doi.org/10.1109/EPEPS.2014.7103611
Vargas, Marcos A. ; Melde, Kathleen L. / Impact of geometry of embedded pattern layer on signal integrity of coupled microstrips. 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 121-124
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