Impact of Ground via Placement in Grounded Coplanar Waveguide Interconnects

Arghya Sain, Kathleen L Melde

Research output: Contribution to journalArticle

17 Scopus citations

Abstract

Methods for higher order parallel plate mode suppression in grounded coplanar waveguides (GCPW) using unique ground via structures are presented in this paper. Suppression of these higher order modes can increase GCPW bandwidth. The ground via fence parameters that affect the bandwidth of the GCPWs are also discussed. Two new structures using staggered ground via fences and with defected side ground planes, for improving GCPW performances while meeting fabrication and routing requirements, are discussed. These two methods improve the interconnect bandwidth by 62.2% and 27.8%, respectively. The measured and simulated results of a test GCPW structure are in close agreement.

Original languageEnglish (US)
Article number7365442
Pages (from-to)136-144
Number of pages9
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume6
Issue number1
DOIs
StatePublished - Jan 1 2016

Keywords

  • Channelized coplanar waveguide (CCPW)
  • conductor backed CPW (CB-CPW)
  • finite ground CB-CPW (FG-CBCPW)
  • grounded CPW (GCPW)
  • modes
  • resonant frequency
  • via
  • via fence.

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering

Fingerprint Dive into the research topics of 'Impact of Ground via Placement in Grounded Coplanar Waveguide Interconnects'. Together they form a unique fingerprint.

  • Cite this