Impact of Novel Pad Groove Designs on Removal Rate and Uniformity of Dielectric and Copper CMP

Toshiroh K. Doy, Kiyoshi Seshimo, Keisuke Suzuki, Ara Philipossian, Masaki Kinoshita

Research output: Contribution to journalArticle

22 Citations (Scopus)

Abstract

The effect of pad surface texture on dielectric and copper removal rates was studied theoretically and experimentally by investigating the fluid behavior of the slurry layer using methodologies similar to those found in tribological investigations of fluid bearings. It is shown that new nonfoamed hard plastic pads with intricate groove patterns are critical in modulating removal rates. Removal rate results of dielectric chemical mechanical polishing were in close agreement with model predictions for several of the groove designs tested. Combined patterns, consisting of spiral and logarithmic grooves, were shown to impact several key attributes of the dielectric and copper processes in terms of slurry retention, hydrodynamic pressure, tribological mechanism, and material removal rates.

Original languageEnglish (US)
JournalJournal of the Electrochemical Society
Volume151
Issue number3
DOIs
StatePublished - 2004

Fingerprint

Cytidine Monophosphate
grooves
Copper
copper
Bearings (structural)
Chemical mechanical polishing
Fluids
fluids
polishing
machining
plastics
Hydrodynamics
textures
Textures
hydrodynamics
methodology
Plastics
predictions

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

Impact of Novel Pad Groove Designs on Removal Rate and Uniformity of Dielectric and Copper CMP. / Doy, Toshiroh K.; Seshimo, Kiyoshi; Suzuki, Keisuke; Philipossian, Ara; Kinoshita, Masaki.

In: Journal of the Electrochemical Society, Vol. 151, No. 3, 2004.

Research output: Contribution to journalArticle

Doy, Toshiroh K. ; Seshimo, Kiyoshi ; Suzuki, Keisuke ; Philipossian, Ara ; Kinoshita, Masaki. / Impact of Novel Pad Groove Designs on Removal Rate and Uniformity of Dielectric and Copper CMP. In: Journal of the Electrochemical Society. 2004 ; Vol. 151, No. 3.
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