Impact of Novel Pad Groove Designs on Removal Rate and Uniformity of Dielectric and Copper CMP

Toshiroh K. Doy, Kiyoshi Seshimo, Keisuke Suzuki, Ara Philipossian, Masaki Kinoshita

Research output: Contribution to journalArticle

25 Scopus citations

Abstract

The effect of pad surface texture on dielectric and copper removal rates was studied theoretically and experimentally by investigating the fluid behavior of the slurry layer using methodologies similar to those found in tribological investigations of fluid bearings. It is shown that new nonfoamed hard plastic pads with intricate groove patterns are critical in modulating removal rates. Removal rate results of dielectric chemical mechanical polishing were in close agreement with model predictions for several of the groove designs tested. Combined patterns, consisting of spiral and logarithmic grooves, were shown to impact several key attributes of the dielectric and copper processes in terms of slurry retention, hydrodynamic pressure, tribological mechanism, and material removal rates.

Original languageEnglish (US)
Pages (from-to)G196-G199
JournalJournal of the Electrochemical Society
Volume151
Issue number3
DOIs
StatePublished - Apr 14 2004

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

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