Implementation of apertures in a MoM-based simulator for stripline packaging problems

Yi Cao, Xing Wang, Derek Nielson, Steven L Dvorak

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An integral-equation-based, Full-Wave Layered Interconnect Simulator (UA-FWLIS) has recently been developed for the simulation of stripline interconnects. In this paper we extend UA-FWLIS so that it can handle apertures in the power/ground planes. Apertures are often cut in power/ground planes to help reduce the effects of the digital noise on the more sensitive analog circuitry. In order to account for the effects of the apertures, we use the field equivalence theorem to define equivalent magnetic currents that flow in the apertures. These magnetic currents interrupt the flow of the electrical currents on the power/ground planes, and they also allow for coupling between traces in adjacent layers in multi-layer stripline structures.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components and Technology Conference
Pages1638-1645
Number of pages8
DOIs
StatePublished - 2007
Event57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States
Duration: May 29 2007Jun 1 2007

Other

Other57th Electronic Components and Technology Conference 2007, ECTC '07
CountryUnited States
CitySparks, NV
Period5/29/076/1/07

Fingerprint

Integral equations
Packaging
Simulators

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Cao, Y., Wang, X., Nielson, D., & Dvorak, S. L. (2007). Implementation of apertures in a MoM-based simulator for stripline packaging problems. In Proceedings - Electronic Components and Technology Conference (pp. 1638-1645). [4250100] https://doi.org/10.1109/ECTC.2007.374014

Implementation of apertures in a MoM-based simulator for stripline packaging problems. / Cao, Yi; Wang, Xing; Nielson, Derek; Dvorak, Steven L.

Proceedings - Electronic Components and Technology Conference. 2007. p. 1638-1645 4250100.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Cao, Y, Wang, X, Nielson, D & Dvorak, SL 2007, Implementation of apertures in a MoM-based simulator for stripline packaging problems. in Proceedings - Electronic Components and Technology Conference., 4250100, pp. 1638-1645, 57th Electronic Components and Technology Conference 2007, ECTC '07, Sparks, NV, United States, 5/29/07. https://doi.org/10.1109/ECTC.2007.374014
Cao Y, Wang X, Nielson D, Dvorak SL. Implementation of apertures in a MoM-based simulator for stripline packaging problems. In Proceedings - Electronic Components and Technology Conference. 2007. p. 1638-1645. 4250100 https://doi.org/10.1109/ECTC.2007.374014
Cao, Yi ; Wang, Xing ; Nielson, Derek ; Dvorak, Steven L. / Implementation of apertures in a MoM-based simulator for stripline packaging problems. Proceedings - Electronic Components and Technology Conference. 2007. pp. 1638-1645
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