Implementation of apertures in a MoM-based simulator for stripline packaging problems

Yi Cao, Xing Wang, Derek Nielson, Steven L. Dvorak

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An integral-equation-based, Full-Wave Layered Interconnect Simulator (UA-FWLIS) has recently been developed for the simulation of stripline interconnects. In this paper we extend UA-FWLIS so that it can handle apertures in the power/ground planes. Apertures are often cut in power/ground planes to help reduce the effects of the digital noise on the more sensitive analog circuitry. In order to account for the effects of the apertures, we use the field equivalence theorem to define equivalent magnetic currents that flow in the apertures. These magnetic currents interrupt the flow of the electrical currents on the power/ground planes, and they also allow for coupling between traces in adjacent layers in multi-layer stripline structures.

Original languageEnglish (US)
Title of host publicationProceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
Pages1638-1645
Number of pages8
DOIs
StatePublished - Oct 22 2007
Event57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States
Duration: May 29 2007Jun 1 2007

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other57th Electronic Components and Technology Conference 2007, ECTC '07
CountryUnited States
CitySparks, NV
Period5/29/076/1/07

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Implementation of apertures in a MoM-based simulator for stripline packaging problems'. Together they form a unique fingerprint.

  • Cite this

    Cao, Y., Wang, X., Nielson, D., & Dvorak, S. L. (2007). Implementation of apertures in a MoM-based simulator for stripline packaging problems. In Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07 (pp. 1638-1645). [4250100] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2007.374014