Implications of wafer size scale -up on frictional, thermal and kinetic attributes of ILD CMP process

D. Rosales-Yeomans, L. Borucki, T. Doi, L. Lujan, K. Ichikawa, Ara Philipossian

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Experiments were performed on a novel 200 mm tribometer in which friction force was acquired in two directions, giving a complete resolution of the force vector in the CMP process. A thermal study of the pad surface was conducted using an infrared video camera to simultaneously measure temperature changes. A Langmuir-Hinshelwood model with a reaction temperature based on a flash heating hypothesis was applied to the experimental data to evaluate the chemical and mechanical contributions during ILD CMP. The results obtained from the 200 mm tribometer were compared to those from a 100 mm tribometer. Results showed that scaling up from 100 to 200 mm caused a transition from a mechanically-limited regime, in which it was still possible to detect thermal effects, to a higher degree of mechanical limitation where it was no longer possible to detect thermal effects.

Original languageEnglish (US)
Title of host publication2005 Proceedings - 22nd International VLSI Multilevel Interconnection Conference, VMIC 2005
Pages188-193
Number of pages6
StatePublished - 2005
Event22nd International VLSI Multilevel Interconnection Conference, VMIC 2005 - Fremont, CA, United States
Duration: Oct 4 2005Oct 6 2005

Other

Other22nd International VLSI Multilevel Interconnection Conference, VMIC 2005
CountryUnited States
CityFremont, CA
Period10/4/0510/6/05

Fingerprint

Thermal effects
Kinetics
Video cameras
Friction
Infrared radiation
Heating
Temperature
Experiments
Hot Temperature

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Rosales-Yeomans, D., Borucki, L., Doi, T., Lujan, L., Ichikawa, K., & Philipossian, A. (2005). Implications of wafer size scale -up on frictional, thermal and kinetic attributes of ILD CMP process. In 2005 Proceedings - 22nd International VLSI Multilevel Interconnection Conference, VMIC 2005 (pp. 188-193)

Implications of wafer size scale -up on frictional, thermal and kinetic attributes of ILD CMP process. / Rosales-Yeomans, D.; Borucki, L.; Doi, T.; Lujan, L.; Ichikawa, K.; Philipossian, Ara.

2005 Proceedings - 22nd International VLSI Multilevel Interconnection Conference, VMIC 2005. 2005. p. 188-193.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Rosales-Yeomans, D, Borucki, L, Doi, T, Lujan, L, Ichikawa, K & Philipossian, A 2005, Implications of wafer size scale -up on frictional, thermal and kinetic attributes of ILD CMP process. in 2005 Proceedings - 22nd International VLSI Multilevel Interconnection Conference, VMIC 2005. pp. 188-193, 22nd International VLSI Multilevel Interconnection Conference, VMIC 2005, Fremont, CA, United States, 10/4/05.
Rosales-Yeomans D, Borucki L, Doi T, Lujan L, Ichikawa K, Philipossian A. Implications of wafer size scale -up on frictional, thermal and kinetic attributes of ILD CMP process. In 2005 Proceedings - 22nd International VLSI Multilevel Interconnection Conference, VMIC 2005. 2005. p. 188-193
Rosales-Yeomans, D. ; Borucki, L. ; Doi, T. ; Lujan, L. ; Ichikawa, K. ; Philipossian, Ara. / Implications of wafer size scale -up on frictional, thermal and kinetic attributes of ILD CMP process. 2005 Proceedings - 22nd International VLSI Multilevel Interconnection Conference, VMIC 2005. 2005. pp. 188-193
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