Innovative techniques for improved testability

Endre F. Sarkany, Robert F. Lusch

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Three independent topics which illustrate innovative methods for improving testability are described. First, a technique which utilizes a card logic tester as a vehicle for evaluating the effectiveness of new chip-level tests is described. This technique allows rapid implementation and verification of various test algorithms as chip failure mechanisms are discovered. Second, a methodology which combines simulation data with the capabilities of a tester language to provide early verification of the AC characteristics of components is presented. Third and finally, the authors consider tester language limitations and how adjustments can be made to component timing specifications to overcome these restrictions. These techniques were successfully implemented using Programming Language for Testing (PLT). With these methods, the testability and hence the quality of recent IBM products were improved in a cost-effective manner.

Original languageEnglish (US)
Title of host publicationDigest of Papers - International Test Conference
PublisherPubl by IEEE
Pages103-108
Number of pages6
ISBN (Print)0818620641
StatePublished - Sep 1 1990
EventProceedings - International Test Conference 1990 - Washington, DC, USA
Duration: Sep 10 1990Sep 14 1990

Publication series

NameDigest of Papers - International Test Conference
ISSN (Print)0743-1686

Other

OtherProceedings - International Test Conference 1990
CityWashington, DC, USA
Period9/10/909/14/90

ASJC Scopus subject areas

  • Engineering(all)

Fingerprint Dive into the research topics of 'Innovative techniques for improved testability'. Together they form a unique fingerprint.

  • Cite this

    Sarkany, E. F., & Lusch, R. F. (1990). Innovative techniques for improved testability. In Digest of Papers - International Test Conference (pp. 103-108). (Digest of Papers - International Test Conference). Publ by IEEE.