Integrated system for design automation of VLSI interconnects and packaging

P. Hsu, Jerzy W Rozenblit, S. N. Pratapneni, C. M. Wolff, J. L. Prince

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The packaging design support environment (PDSE) is a software system being developed at the University of Arizona to facilitate the analysis and design of packaging structures for microelectronic integrated circuits, a subject which is becoming one of increasing importance with higher circuit integration and system performance. PDSE provides a platform for work in several active research areas including interconnect and packaging modeling and simulation in electrical, thermal, and thermal-mechanical aspects, CAD framework development and evaluations for performance, manufacturability, and reliability, etc. This paper describes the overall architecture and characteristics of the PDSE system in development, its implementation and applications.

Original languageEnglish (US)
Title of host publicationMidwest Symposium on Circuits and Systems
PublisherPubl by IEEE
Pages847-850
Number of pages4
Volume2
ISBN (Print)0780317610
StatePublished - 1993
EventProceedings of the 36th Midwest Symposium on Circuits and Systems - Detroit, MI, USA
Duration: Aug 16 1993Aug 18 1993

Other

OtherProceedings of the 36th Midwest Symposium on Circuits and Systems
CityDetroit, MI, USA
Period8/16/938/18/93

Fingerprint

Packaging
Automation
Microelectronics
Integrated circuits
Computer aided design
Networks (circuits)
Hot Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Hsu, P., Rozenblit, J. W., Pratapneni, S. N., Wolff, C. M., & Prince, J. L. (1993). Integrated system for design automation of VLSI interconnects and packaging. In Midwest Symposium on Circuits and Systems (Vol. 2, pp. 847-850). Publ by IEEE.

Integrated system for design automation of VLSI interconnects and packaging. / Hsu, P.; Rozenblit, Jerzy W; Pratapneni, S. N.; Wolff, C. M.; Prince, J. L.

Midwest Symposium on Circuits and Systems. Vol. 2 Publ by IEEE, 1993. p. 847-850.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hsu, P, Rozenblit, JW, Pratapneni, SN, Wolff, CM & Prince, JL 1993, Integrated system for design automation of VLSI interconnects and packaging. in Midwest Symposium on Circuits and Systems. vol. 2, Publ by IEEE, pp. 847-850, Proceedings of the 36th Midwest Symposium on Circuits and Systems, Detroit, MI, USA, 8/16/93.
Hsu P, Rozenblit JW, Pratapneni SN, Wolff CM, Prince JL. Integrated system for design automation of VLSI interconnects and packaging. In Midwest Symposium on Circuits and Systems. Vol. 2. Publ by IEEE. 1993. p. 847-850
Hsu, P. ; Rozenblit, Jerzy W ; Pratapneni, S. N. ; Wolff, C. M. ; Prince, J. L. / Integrated system for design automation of VLSI interconnects and packaging. Midwest Symposium on Circuits and Systems. Vol. 2 Publ by IEEE, 1993. pp. 847-850
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