Integrity and continuity of sensor-based collision warning systems using vehicle-to-vehicle communication

Gustavo Lee, Mathieu Joerger

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

This paper describes the design and implementation of a new safety risk evaluation method for a sensor-based automotive collision warning system using vehicle-to-vehicle (V2V) communication. The paper provides an overview of the V2V basic safety message (BSM) format and of surrogate measures of safety (SMS) used to parameterize a vehicle encounter. BSM and SMS are then employed to quantify risk of collision and risk of false alerts. Preliminary simulations illustrate the methodology in an example multi-sensor intersection movement assist system.

Original languageEnglish (US)
Title of host publication2018 IEEE/ION Position, Location and Navigation Symposium, PLANS 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1059-1068
Number of pages10
ISBN (Electronic)9781538616475
DOIs
StatePublished - Jun 5 2018
Event2018 IEEE/ION Position, Location and Navigation Symposium, PLANS 2018 - Monterey, United States
Duration: Apr 23 2018Apr 26 2018

Publication series

Name2018 IEEE/ION Position, Location and Navigation Symposium, PLANS 2018 - Proceedings

Other

Other2018 IEEE/ION Position, Location and Navigation Symposium, PLANS 2018
CountryUnited States
CityMonterey
Period4/23/184/26/18

Keywords

  • Automated
  • Collision warning
  • Connected
  • Integrity
  • Vehicle-to-vehicle

ASJC Scopus subject areas

  • Automotive Engineering
  • Aerospace Engineering
  • Control and Optimization

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  • Cite this

    Lee, G., & Joerger, M. (2018). Integrity and continuity of sensor-based collision warning systems using vehicle-to-vehicle communication. In 2018 IEEE/ION Position, Location and Navigation Symposium, PLANS 2018 - Proceedings (pp. 1059-1068). (2018 IEEE/ION Position, Location and Navigation Symposium, PLANS 2018 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/PLANS.2018.8373487