Interaction between Ceria and Hydroxylamine

Subramanian Tamilmani, Jilei Shan, Wayne Huang, Srini Raghavan, Robert Small, Cass Shang, Brandon Scott

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations


Ceria containing slurries are increasingly used in the chemical mechanical polishing of CVD silicon oxide films to obtain STI structures. Unlike silica or alumina, ceria has redox characteristics. Because of this characteristic, removal of ceria particles from planarized surfaces may be possible using chemical reagents that can participate in redox reactions. One such reagent is hydroxylamine, which is already being used in copper CMP. The objective of the work reported in this paper was to characterize the reaction between ceria and hydroxylamine, especially with respect to dissolution of ceria particles. A kinetic study of the dissolution of ceria in hydroxylamine solutions maintained at various pH values has been performed. The extent and kinetics of dissolution of ceria has been determined by ICPMS. Removal of ceria particles from oxide surfaces using hydroxylamine-based chemistries has been investigated.

Original languageEnglish (US)
Title of host publicationMaterials Research Society Symposium - Proceedings
EditorsD.S. Boning, K. Devriendt, M.R. Oliver, D.J. Stein, I. Vos
Number of pages6
Publication statusPublished - 2003
EventChemical-Mechanical Planarization - San Francisco, CA, United States
Duration: Apr 22 2003Apr 24 2003


OtherChemical-Mechanical Planarization
CountryUnited States
CitySan Francisco, CA


ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Tamilmani, S., Shan, J., Huang, W., Raghavan, S., Small, R., Shang, C., & Scott, B. (2003). Interaction between Ceria and Hydroxylamine. In D. S. Boning, K. Devriendt, M. R. Oliver, D. J. Stein, & I. Vos (Eds.), Materials Research Society Symposium - Proceedings (Vol. 767, pp. 161-166)