Interaction between wafer cleanliness and wafer effects

P. W. Mertens, M. Meuris, H. F. Schmidt, S. Verhaverbeke, M. M. Heyns, D. Graef, A. Schnegg, M. Kubota, K. Dillenbeck, Ara Philipossian

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

In this paper the effect of Fe, on gate oxide integrity (GOI) is discussed. It is demonstrated that the effect of Fe on GOI is strongly dependent on the silicon substrate. Therefore different kinds of wafers have been used. Whereas the Fe-contaminated wafers show circular patterns of degraded GOI performance, such patterns could not be observed on clean reference wafers. The GOI performance of the Fe-contaminated wafers is described using a new comprehensive statistical model.

Original languageEnglish (US)
Title of host publicationProceedings, Annual Technical Meeting - Institute of Environmental Sciences
Editors Anon
PublisherPubl by Inst of Environmental Sciences
Pages231-237
Number of pages7
Volume1
ISBN (Print)1877862193
StatePublished - 1993
Externally publishedYes
EventProceedings of the 39th Annual Technical Meeting of Institute of Environmental Sciences - Las Vegas, NV, USA
Duration: May 2 1993May 7 1993

Other

OtherProceedings of the 39th Annual Technical Meeting of Institute of Environmental Sciences
CityLas Vegas, NV, USA
Period5/2/935/7/93

Fingerprint

Oxides
Silicon
Substrates
Statistical Models

ASJC Scopus subject areas

  • Environmental Engineering

Cite this

Mertens, P. W., Meuris, M., Schmidt, H. F., Verhaverbeke, S., Heyns, M. M., Graef, D., ... Philipossian, A. (1993). Interaction between wafer cleanliness and wafer effects. In Anon (Ed.), Proceedings, Annual Technical Meeting - Institute of Environmental Sciences (Vol. 1, pp. 231-237). Publ by Inst of Environmental Sciences.

Interaction between wafer cleanliness and wafer effects. / Mertens, P. W.; Meuris, M.; Schmidt, H. F.; Verhaverbeke, S.; Heyns, M. M.; Graef, D.; Schnegg, A.; Kubota, M.; Dillenbeck, K.; Philipossian, Ara.

Proceedings, Annual Technical Meeting - Institute of Environmental Sciences. ed. / Anon. Vol. 1 Publ by Inst of Environmental Sciences, 1993. p. 231-237.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mertens, PW, Meuris, M, Schmidt, HF, Verhaverbeke, S, Heyns, MM, Graef, D, Schnegg, A, Kubota, M, Dillenbeck, K & Philipossian, A 1993, Interaction between wafer cleanliness and wafer effects. in Anon (ed.), Proceedings, Annual Technical Meeting - Institute of Environmental Sciences. vol. 1, Publ by Inst of Environmental Sciences, pp. 231-237, Proceedings of the 39th Annual Technical Meeting of Institute of Environmental Sciences, Las Vegas, NV, USA, 5/2/93.
Mertens PW, Meuris M, Schmidt HF, Verhaverbeke S, Heyns MM, Graef D et al. Interaction between wafer cleanliness and wafer effects. In Anon, editor, Proceedings, Annual Technical Meeting - Institute of Environmental Sciences. Vol. 1. Publ by Inst of Environmental Sciences. 1993. p. 231-237
Mertens, P. W. ; Meuris, M. ; Schmidt, H. F. ; Verhaverbeke, S. ; Heyns, M. M. ; Graef, D. ; Schnegg, A. ; Kubota, M. ; Dillenbeck, K. ; Philipossian, Ara. / Interaction between wafer cleanliness and wafer effects. Proceedings, Annual Technical Meeting - Institute of Environmental Sciences. editor / Anon. Vol. 1 Publ by Inst of Environmental Sciences, 1993. pp. 231-237
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