Interconnect simulation based on passivity and method of characteristics

E. S. Kuh, J. F. Mao, M. L. Wang

Research output: Contribution to conferencePaper

2 Scopus citations

Abstract

Interconnect analysis modeling, and simulation will play a major role in the future design of submicron IC and electronic packaging. Existing simulation methods by and large depend on convolution and the well-known Pade approximation of transcendental functions which characterize transmission lines. Unfortunately, Pade approximation does not guarantee stability. In this paper two methods are presented. One is based on using the concept of passivity, and the other uses the traditional method of characteristics. Preliminary results obtained on simple examples are very encouraging.

Original languageEnglish (US)
Pages449-457
Number of pages9
StatePublished - Dec 1 1996
Externally publishedYes
EventProceedings of the 1996 IEEE Asia Pacific Conference on Circuits and Systems - Seoul, South Korea
Duration: Nov 18 1996Nov 21 1996

Other

OtherProceedings of the 1996 IEEE Asia Pacific Conference on Circuits and Systems
CitySeoul, South Korea
Period11/18/9611/21/96

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Kuh, E. S., Mao, J. F., & Wang, M. L. (1996). Interconnect simulation based on passivity and method of characteristics. 449-457. Paper presented at Proceedings of the 1996 IEEE Asia Pacific Conference on Circuits and Systems, Seoul, South Korea, .