Interconnect simulation based on passivity and method of characteristics

E. S. Kuh, J. F. Mao, Meiling Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Interconnect analysis modeling, and simulation will play a major role in the future design of submicron IC and electronic packaging. Existing simulation methods by and large depend on convolution and the well-known Pade approximation of transcendental functions which characterize transmission lines. Unfortunately, Pade approximation does not guarantee stability. In this paper two methods are presented. One is based on using the concept of passivity, and the other uses the traditional method of characteristics. Preliminary results obtained on simple examples are very encouraging.

Original languageEnglish (US)
Title of host publicationIEEE Asia-Pacific Conference on Circuits and Systems - Proceedings
PublisherIEEE
Pages449-457
Number of pages9
Publication statusPublished - 1996
Externally publishedYes
EventProceedings of the 1996 IEEE Asia Pacific Conference on Circuits and Systems - Seoul, South Korea
Duration: Nov 18 1996Nov 21 1996

Other

OtherProceedings of the 1996 IEEE Asia Pacific Conference on Circuits and Systems
CitySeoul, South Korea
Period11/18/9611/21/96

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Kuh, E. S., Mao, J. F., & Wang, M. (1996). Interconnect simulation based on passivity and method of characteristics. In IEEE Asia-Pacific Conference on Circuits and Systems - Proceedings (pp. 449-457). IEEE.