Investigating effect of conditioner aggressiveness on removal rate during interlayer dielectric chemical mechanical planarization through confocal microscopy and dual emission ultraviolet-enhanced fluorescence imaging

Ting Sun, Len Borucki, Yun Zhuang, Yasa Sampurno, Fransisca Sudargho, Xiaomin Wei, Sriram Anjur, Ara Philipossian

Research output: Contribution to journalArticlepeer-review

28 Scopus citations

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Engineering & Materials Science

Physics & Astronomy