Investigating the effect of diamond size and conditioning force on chemical mechanical planarization pad topography

T. Sun, L. Borucki, Y. Zhuang, Ara Philipossian

Research output: Contribution to journalArticle

29 Citations (Scopus)

Abstract

Pad conditioning plays an important role in chemical mechanical planarization processes as it directly impacts pad topography and polishing performance. As predicted by the conditioning, friction and removal rate theories, the conditioning process impacts polishing rate through a key measure of the pad surface known as surface abruptness (λ). In this study, incremental loading as well as interferometry methods are used to analyze pad surface topography in terms of λ when the pads are conditioned using discs with different diamond grit sizes at different loads. Moreover, the pad surface is analyzed mechanically and compared in both dry and moist conditions. Results agree well with the theoretical predictions both in the dry and the moist conditions.

Original languageEnglish (US)
Pages (from-to)553-559
Number of pages7
JournalMicroelectronic Engineering
Volume87
Issue number4
DOIs
StatePublished - Apr 2010

Fingerprint

Diamond
Chemical mechanical polishing
conditioning
Topography
Diamonds
topography
diamonds
Polishing
Surface topography
polishing
Interferometry
Friction
grit
interferometry
friction
predictions

Keywords

  • Chemical mechanical planarization
  • Diamond disc
  • Pad topography
  • Surface abruptness

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics

Cite this

Investigating the effect of diamond size and conditioning force on chemical mechanical planarization pad topography. / Sun, T.; Borucki, L.; Zhuang, Y.; Philipossian, Ara.

In: Microelectronic Engineering, Vol. 87, No. 4, 04.2010, p. 553-559.

Research output: Contribution to journalArticle

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