Investigation of diamond effect on pad topography, friction force and removal rate during ILD CMP Process

Y. Zhuang, L. Borucki, N. Rikita, F. Sudargho, Y. Sampumo, X. Wei, G. Steward, A. Philipossian

Research output: Contribution to conferencePaperpeer-review

4 Scopus citations

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Engineering & Materials Science