Investigation of power/ground plane resonance reduction using lumped RC elements

George W. Peterson, John L. Prince, Kathleen L. Virga

Research output: Contribution to journalConference article

Abstract

A study of reducing package resonance between power and ground planes with discrete RC components is presented. Package resonance is an inherent problem in electronic packages that use solid power planes because of parallel plate standing waves that may appear. The standing waves produce resonant spikes in the impedance seen by a device that is connected to the power delivery system. The RC components function to disrupt some of these patterns thereby flattening the resonant impedance spikes by providing a 'matched load' to the power and ground plane impedance while maintaining DC isolation between the planes.

Original languageEnglish (US)
Pages (from-to)769-774
Number of pages6
JournalProceedings - Electronic Components and Technology Conference
StatePublished - Dec 1 2000

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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