Investigation of pre-tungsten silicide deposition wet chemical processing

A. Philipossian, M. Moinpour, R. Wilkinson, V. H.C. Watt

Research output: Contribution to journalConference article

1 Scopus citations

Abstract

Removing the native oxide from the poly-Si surface prior to WSix deposition is essential for achieving high quality silicides as well as sufficient film adhesion, particularly after high temperature anneal or oxidation. Contact angle studies have been used to determine initial and time-dependent surface characteristics of several types of silicon surfaces following immersions in HF-based etchants for varying amounts of time. The morphological characteristics of the surfaces before and after exposure to etchants, as well as the relative etch rates and wetting capabilities of the etchants have been used to explain the following results: With respect to initial contact angle studies, the implanted & annealed polycrystalline silicon surface has the lowest contact angle followed by polycrystalline and monocrystalline surfaces. Longer immersion times yield lower initial contact angles. The 0.1% lightly-buffered HF solution results in the highest contact angle followed by the 1% buffered HF solution with surfactant, and the 1% HF solution. With respect to contact angle changes during ambient air exposure time, the as-deposited polycrystalline silicon surface is most stable followed by monocrystalline, and implanted & annealed polycrystalline silicon surfaces. Longer immersion times improve surface stability while the 0.1% lightly-buffered HF solution results in the most stable surface followed by the 1% buffered HF solution with surfactant, and the 1% HF solution.

Original languageEnglish (US)
Pages (from-to)75-82
Number of pages8
JournalMaterials Research Society Symposium - Proceedings
Volume386
StatePublished - Dec 1 1995
Externally publishedYes
EventProceedings of the 1995 MRS Spring Meeting - San Francisco, CA, USA
Duration: Apr 17 1995Apr 21 1995

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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