The kinetics of copper cementation on a rotating disc of pure aluminum were studied as a function of chloride ion concentration, copper ion concentyration, and temperature. The optimum experimental conditions for all the parameters were determined. Chloride ion was found to destroy the naturally existing aluminum oxide film, and enabled the cementation reaction to proceed. A two-step rate, observed in most of the experiments, was attributed to the attainment of a roughened surface. An Evans diagram for the copper-pure aluminum system was constructed and utilized in predicting the controlling mechanism of the system.
|Original language||English (US)|
|Title of host publication||Min Eng (New York)|
|Number of pages||10|
|Publication status||Published - Jun 1978|
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