KINETIC STUDY OF COPPER CEMENTATION ON PURE ALUMINUM

V. Annamalai, J Brent Hiskey

Research output: Chapter in Book/Report/Conference proceedingChapter

12 Scopus citations

Abstract

The kinetics of copper cementation on a rotating disc of pure aluminum were studied as a function of chloride ion concentration, copper ion concentyration, and temperature. The optimum experimental conditions for all the parameters were determined. Chloride ion was found to destroy the naturally existing aluminum oxide film, and enabled the cementation reaction to proceed. A two-step rate, observed in most of the experiments, was attributed to the attainment of a roughened surface. An Evans diagram for the copper-pure aluminum system was constructed and utilized in predicting the controlling mechanism of the system.

Original languageEnglish (US)
Title of host publicationMin Eng (New York)
Pages650-659
Number of pages10
Volume30
Edition6
Publication statusPublished - Jun 1978
Externally publishedYes

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

Annamalai, V., & Hiskey, J. B. (1978). KINETIC STUDY OF COPPER CEMENTATION ON PURE ALUMINUM. In Min Eng (New York) (6 ed., Vol. 30, pp. 650-659)