Laser modulation simulation of micro-crack morphology evolution during chemical etching

Zhi Chen, Huapan Xiao, Zhibin Li, Na Yu, Hairong Wang, Rongguang Liang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Subsurface micro-cracks will be generated during the grinding and polishing processes of optical components. Microcracks have a modulation effect on the laser, thereby reducing the laser damage threshold. The FDTD method is used to simulate the light intensity distribution modulated by micro-crack. By comparing the simulation results of radial crack, parabolic crack and elliptic crack, the modulation mechanism of micro-crack is revealed. The results show that for the crack with the same width and depth, light intensity enhancement factor (LIEF) modulated by radial crack on the rear surface and parabolic crack on the front surface is the largest; LIEF modulated by elliptical crack on the rear surface and radial crack on the front surface is the smallest. In addition, when the crack width-depth ratio is the same, the larger the depth, the higher the LIEF. As the width-depth ratio increases, the LIEF value increases firstly, then decreases, and finally approaches a stable value.

Original languageEnglish (US)
Title of host publicationPacific-Rim Laser Damage 2019
Subtitle of host publicationOptical Materials for High-Power Lasers
EditorsJianda Shao, Takahisa Jitsuno, Wolfgang Rudolph
PublisherSPIE
ISBN (Electronic)9781510628168
DOIs
StatePublished - 2019
EventPacific-Rim Laser Damage 2019: Optical Materials for High-Power Lasers - Qingdao, China
Duration: May 19 2019May 22 2019

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume11063
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferencePacific-Rim Laser Damage 2019: Optical Materials for High-Power Lasers
CountryChina
CityQingdao
Period5/19/195/22/19

Keywords

  • Elliptical crack
  • FDTD
  • Light intensity enhancement factor
  • Parabolic crack
  • Radical crack

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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