Measurement and removal of dissolved colloidal silica in ultrapure water

J. Wibowo, F. Shadman, D. Bleckford

Research output: Contribution to conferencePaperpeer-review

Abstract

As the worldwide manufacture of semiconductors continues to grow, the semiconductor industry needs increasing amounts of ultrapure water. This water, used to physically wash the surface of silicon wafers to remove process contamination, has become a vital part of manufacturing an integrated circuit. The combined use of water purification techniques such as ion exchange, reverse osmosis, filtration, and ultraviolet (UV) sterilization, and other technologies have enabled the semiconductor industry to become the world's largest user of ultrapure water. The presence of silica in high purity water can be particularly detrimental to the manufacture of semiconductors on the surface of a single crystal of silicon. Unfortunately silicon is one of earth's most abundant elements and easily finds its way into all water supplies. The colloidal form of silica is particularly difficult to remove and detect. This paper reviews the different silica measurement procedures available and presents a new method for dissolving colloidal silica using an ultraviolet/ozone technique.

Original languageEnglish (US)
Pages43-58
Number of pages16
StatePublished - Jan 1 1997
EventProceedings of the 1997 16th Annual Semiconductor Pure Water and Chemicals, SPWCC. Part 2 (of 2) - Santa Clara, CA, USA
Duration: Mar 3 1997Mar 7 1997

Other

OtherProceedings of the 1997 16th Annual Semiconductor Pure Water and Chemicals, SPWCC. Part 2 (of 2)
CitySanta Clara, CA, USA
Period3/3/973/7/97

ASJC Scopus subject areas

  • Water Science and Technology
  • Electronic, Optical and Magnetic Materials

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