Mechanical characterization of ultra-thin films by combining AFM nanoindentation tests and peridynamic simulations

Emrah Celik, Erkan Oterkus, Ibrahim Guven, Erdogan Madenci

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Scopus citations

Abstract

In this study, the loading-unloading data obtained from the nono-indentation tests in combination with the peridynamic simulations are used to determine the elastic modulus and yield stress of the material. A simple search algorithm minimizing the difference between the predicted force- indentation depth and experiments leads to the determination of the material properties. Nano-indentation experiments are performed on both a soft polymer (polymethyldisiloxane (PDMS)) representative of the bulk dimensions, and a hard thin-film polymer (polystyrene (PS)) deposited on the bulk PDMS. Both the simulation and experimental results are validated by comparison against those previously published in the literature.

Original languageEnglish (US)
Title of host publication2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009
Pages262-268
Number of pages7
DOIs
StatePublished - Oct 12 2009
Event2009 59th Electronic Components and Technology Conference, ECTC 2009 - San Diego, CA, United States
Duration: May 26 2009May 29 2009

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other2009 59th Electronic Components and Technology Conference, ECTC 2009
CountryUnited States
CitySan Diego, CA
Period5/26/095/29/09

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Celik, E., Oterkus, E., Guven, I., & Madenci, E. (2009). Mechanical characterization of ultra-thin films by combining AFM nanoindentation tests and peridynamic simulations. In 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009 (pp. 262-268). [5074026] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2009.5074026