Mechanical properties of chemical mechanical polishing pads containing water-soluble particles

L. Charns, M. Sugiyama, Ara Philipossian

Research output: Contribution to journalArticle

16 Citations (Scopus)

Abstract

Non-porous pads containing varying amounts of embedded water-soluble particles (WSP) have been characterized and compared to porous pads for interlayer dielectric chemical mechanical planarization (CMP) applications. In situ infrared imaging of the pad shows temperatures increasing as a function of pressure and velocity. Results also indicate that pad surface temperatures can increase up to 10 °C for a 1-min polish. Thermal information proves to be a critical component in explaining the viscoelastic response of the pad as a result of CMP process temperatures. Glass transition temperatures for WSP-containing pads occur within standard CMP operating temperatures (20-40 °C). Comparative storage modulus trends demonstrate steeper decreasing slopes with increasing temperature for WSP-containing pads than the IC-1000. The gradually decreasing slope for the IC-1000 is a sign of a highly cross-linked material. WSP-containing pads also exhibit a greater energy loss due to heat as quantified by the difference in tan δ. Regardless of whether a pad is new or used, dynamic mechanical analysis results indicate similar bulk properties.

Original languageEnglish (US)
Pages (from-to)188-193
Number of pages6
JournalThin Solid Films
Volume485
Issue number1-2
DOIs
StatePublished - Aug 1 2005

Fingerprint

Chemical mechanical polishing
polishing
mechanical properties
Mechanical properties
Water
water
Temperature
Industrial Oils
Infrared imaging
Dynamic mechanical analysis
Energy dissipation
slopes
Elastic moduli
operating temperature
glass transition temperature
surface temperature
temperature
interlayers
energy dissipation
trends

Keywords

  • Elastic properties
  • Planarization
  • Semiconductors

ASJC Scopus subject areas

  • Surfaces, Coatings and Films
  • Condensed Matter Physics
  • Surfaces and Interfaces

Cite this

Mechanical properties of chemical mechanical polishing pads containing water-soluble particles. / Charns, L.; Sugiyama, M.; Philipossian, Ara.

In: Thin Solid Films, Vol. 485, No. 1-2, 01.08.2005, p. 188-193.

Research output: Contribution to journalArticle

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