Megasonic Cleaning for Particle Removal

Manish K Keswani, Rajesh Balachandran, Pierre A Deymier

Research output: Chapter in Book/Report/Conference proceedingChapter

1 Scopus citations

Abstract

This chapter covers fundamental aspects of megasonic cleaning with special emphasis on acoustic cavitation and streaming. The first part of the chapter focuses on various forms of cavitation (stable and transient) and streaming (Eckart, Schlichting, and Rayleigh) and their physical effects in liquids including microstreaming, shock waves, and liquid microjets. A review of studies by several researchers on the role of various sound field and solution parameters on particle removal and feature damage during megasonic cleaning is provided in the second part of the chapter. The importance of understanding the cleaning mechanisms and optimization of process variables in achieving damage-free and effective megasonic cleaning process is also highlighted.

Original languageEnglish (US)
Title of host publicationParticle Adhesion and Removal
Publisherwiley
Pages243-279
Number of pages37
ISBN (Electronic)9781118831571
ISBN (Print)9781118831533
DOIs
StatePublished - Feb 6 2015

Keywords

  • Acoustic cavitation
  • Acoustic streaming
  • Megasonic cleaning
  • Particle removal
  • Silicon wafer

ASJC Scopus subject areas

  • Engineering(all)
  • Materials Science(all)

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  • Cite this

    Keswani, M. K., Balachandran, R., & Deymier, P. A. (2015). Megasonic Cleaning for Particle Removal. In Particle Adhesion and Removal (pp. 243-279). wiley. https://doi.org/10.1002/9781118831571.ch6