Metallic copper corrosion rates, moisture content, and growth medium influence survival of copper ion-resistant bacteria

Jutta Elguindi, Stuart Moffitt, Henrik Hasman, Cassandra Andrade, Srini Raghavan, Christopher Rensing

Research output: Contribution to journalArticle

40 Citations (Scopus)

Abstract

The rapid killing of various bacteria in contact with metallic copper is thought to be influenced by the influx of copper ions into the cells, but the exact mechanism is not fully understood. This study showed that the kinetics of contact killing of copper surfaces depended greatly on the amount of moisture present, copper content of alloys, type of medium used, and type of bacteria. We examined antibiotic- and copper ion-resistant strains of Escherichia coli and Enterococcus faecium isolated from pig farms following the use of copper sulfate as feed supplement. The results showed rapid killing of both copper ion-resistant E. coli and E. faecium strains when samples in rich medium were spread in a thin, moist layer on copper alloys with 85% or greater copper content. E. coli strains were rapidly killed under dry conditions, while E. faecium strains were less affected. Electroplated copper surface corrosion rates were determined from electrochemical polarization tests using the Stern-Geary method and revealed decreased corrosion rates with benzotriazole and thermal oxide coating. Copper ion-resistant E. coli and E. faecium cells suspended in 0.8% NaCl showed prolonged survival rates on electroplated copper surfaces with benzotriazole coating and thermal oxide coating compared to surfaces without anti-corrosion treatment. Control of surface corrosion affected the level of copper ion influx into bacterial cells, which contributed directly to bacterial killing.

Original languageEnglish (US)
Pages (from-to)1963-1970
Number of pages8
JournalApplied Microbiology and Biotechnology
Volume89
Issue number6
DOIs
StatePublished - Mar 2011

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Corrosion
Copper
Ions
Bacteria
Growth
Enterococcus faecium
Escherichia coli
Oxides
Hot Temperature
Copper Sulfate
Swine

Keywords

  • Copper ion-resistant bacteria
  • Corrosion inhibitors
  • Metallic copper surface corrosion
  • Survival assay

ASJC Scopus subject areas

  • Biotechnology
  • Applied Microbiology and Biotechnology

Cite this

Metallic copper corrosion rates, moisture content, and growth medium influence survival of copper ion-resistant bacteria. / Elguindi, Jutta; Moffitt, Stuart; Hasman, Henrik; Andrade, Cassandra; Raghavan, Srini; Rensing, Christopher.

In: Applied Microbiology and Biotechnology, Vol. 89, No. 6, 03.2011, p. 1963-1970.

Research output: Contribution to journalArticle

Elguindi, Jutta ; Moffitt, Stuart ; Hasman, Henrik ; Andrade, Cassandra ; Raghavan, Srini ; Rensing, Christopher. / Metallic copper corrosion rates, moisture content, and growth medium influence survival of copper ion-resistant bacteria. In: Applied Microbiology and Biotechnology. 2011 ; Vol. 89, No. 6. pp. 1963-1970.
@article{0d4581d7e95345488b6a70bcd8879818,
title = "Metallic copper corrosion rates, moisture content, and growth medium influence survival of copper ion-resistant bacteria",
abstract = "The rapid killing of various bacteria in contact with metallic copper is thought to be influenced by the influx of copper ions into the cells, but the exact mechanism is not fully understood. This study showed that the kinetics of contact killing of copper surfaces depended greatly on the amount of moisture present, copper content of alloys, type of medium used, and type of bacteria. We examined antibiotic- and copper ion-resistant strains of Escherichia coli and Enterococcus faecium isolated from pig farms following the use of copper sulfate as feed supplement. The results showed rapid killing of both copper ion-resistant E. coli and E. faecium strains when samples in rich medium were spread in a thin, moist layer on copper alloys with 85{\%} or greater copper content. E. coli strains were rapidly killed under dry conditions, while E. faecium strains were less affected. Electroplated copper surface corrosion rates were determined from electrochemical polarization tests using the Stern-Geary method and revealed decreased corrosion rates with benzotriazole and thermal oxide coating. Copper ion-resistant E. coli and E. faecium cells suspended in 0.8{\%} NaCl showed prolonged survival rates on electroplated copper surfaces with benzotriazole coating and thermal oxide coating compared to surfaces without anti-corrosion treatment. Control of surface corrosion affected the level of copper ion influx into bacterial cells, which contributed directly to bacterial killing.",
keywords = "Copper ion-resistant bacteria, Corrosion inhibitors, Metallic copper surface corrosion, Survival assay",
author = "Jutta Elguindi and Stuart Moffitt and Henrik Hasman and Cassandra Andrade and Srini Raghavan and Christopher Rensing",
year = "2011",
month = "3",
doi = "10.1007/s00253-010-2980-x",
language = "English (US)",
volume = "89",
pages = "1963--1970",
journal = "Applied Microbiology and Biotechnology",
issn = "0175-7598",
publisher = "Springer Verlag",
number = "6",

}

TY - JOUR

T1 - Metallic copper corrosion rates, moisture content, and growth medium influence survival of copper ion-resistant bacteria

AU - Elguindi, Jutta

AU - Moffitt, Stuart

AU - Hasman, Henrik

AU - Andrade, Cassandra

AU - Raghavan, Srini

AU - Rensing, Christopher

PY - 2011/3

Y1 - 2011/3

N2 - The rapid killing of various bacteria in contact with metallic copper is thought to be influenced by the influx of copper ions into the cells, but the exact mechanism is not fully understood. This study showed that the kinetics of contact killing of copper surfaces depended greatly on the amount of moisture present, copper content of alloys, type of medium used, and type of bacteria. We examined antibiotic- and copper ion-resistant strains of Escherichia coli and Enterococcus faecium isolated from pig farms following the use of copper sulfate as feed supplement. The results showed rapid killing of both copper ion-resistant E. coli and E. faecium strains when samples in rich medium were spread in a thin, moist layer on copper alloys with 85% or greater copper content. E. coli strains were rapidly killed under dry conditions, while E. faecium strains were less affected. Electroplated copper surface corrosion rates were determined from electrochemical polarization tests using the Stern-Geary method and revealed decreased corrosion rates with benzotriazole and thermal oxide coating. Copper ion-resistant E. coli and E. faecium cells suspended in 0.8% NaCl showed prolonged survival rates on electroplated copper surfaces with benzotriazole coating and thermal oxide coating compared to surfaces without anti-corrosion treatment. Control of surface corrosion affected the level of copper ion influx into bacterial cells, which contributed directly to bacterial killing.

AB - The rapid killing of various bacteria in contact with metallic copper is thought to be influenced by the influx of copper ions into the cells, but the exact mechanism is not fully understood. This study showed that the kinetics of contact killing of copper surfaces depended greatly on the amount of moisture present, copper content of alloys, type of medium used, and type of bacteria. We examined antibiotic- and copper ion-resistant strains of Escherichia coli and Enterococcus faecium isolated from pig farms following the use of copper sulfate as feed supplement. The results showed rapid killing of both copper ion-resistant E. coli and E. faecium strains when samples in rich medium were spread in a thin, moist layer on copper alloys with 85% or greater copper content. E. coli strains were rapidly killed under dry conditions, while E. faecium strains were less affected. Electroplated copper surface corrosion rates were determined from electrochemical polarization tests using the Stern-Geary method and revealed decreased corrosion rates with benzotriazole and thermal oxide coating. Copper ion-resistant E. coli and E. faecium cells suspended in 0.8% NaCl showed prolonged survival rates on electroplated copper surfaces with benzotriazole coating and thermal oxide coating compared to surfaces without anti-corrosion treatment. Control of surface corrosion affected the level of copper ion influx into bacterial cells, which contributed directly to bacterial killing.

KW - Copper ion-resistant bacteria

KW - Corrosion inhibitors

KW - Metallic copper surface corrosion

KW - Survival assay

UR - http://www.scopus.com/inward/record.url?scp=79952575100&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=79952575100&partnerID=8YFLogxK

U2 - 10.1007/s00253-010-2980-x

DO - 10.1007/s00253-010-2980-x

M3 - Article

C2 - 21085951

AN - SCOPUS:79952575100

VL - 89

SP - 1963

EP - 1970

JO - Applied Microbiology and Biotechnology

JF - Applied Microbiology and Biotechnology

SN - 0175-7598

IS - 6

ER -