Method for accelerated diamond fracture characterization in chemical mechanical planarization

Ruochen Han, Xiaomin Wei, Yun Zhuang, Yasa Adi Sampurno, Ara Philipossian

Research output: Contribution to journalArticle

3 Scopus citations

Abstract

An accelerated method for diamond fracture characterization in chemical mechanical planarization processes was developed and several practice examples were described showing that the accelerated fracture test was appropriate for differentiating among typical diamond conditioner disks. First, the top ten aggressive diamonds for each of the three conditioner disks tested were identified and imaged using scanning electron microscopy (SEM). Next, the three disks were subjected to a 30-min accelerated fracture test against an aluminum plate on an Araca APD-800 polisher. SEM images were taken again on the same ten most aggressive diamonds. Even though the accelerated fracture test was designed to be analogous to conventional pad conditioning, significant changes to the diamonds could be seen only after 30 min of conditioning. Image analysis demonstrated that diamond fracture occurred in all three cases, but to very different extents.

Original languageEnglish (US)
Pages (from-to)37-40
Number of pages4
JournalMicroelectronic Engineering
Volume149
DOIs
StatePublished - Jan 5 2016

Keywords

  • Aggressive diamond
  • Chemical mechanical planarization
  • Diamond fracture

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics

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