Method for determining the lubrication mechanism of post-ILD CMP brush scrubbing

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A method using spectral analysis of friction data is established to determine the tribological mechanism of post-interlevel dielectric (post-ILD) chemical mechanical planarization (CMP) brush scrubbing as a function of solution pH, pressure, and tool kinematics. Spectral analysis based on real-time raw friction data is used to quantify the total amount of mechanical interaction in the brush-fluid-wafer interface in terms of stick-slip phenomena. Friction force variance (2) criterion is established to determine the tribological mechanism during scrubbing, and compared to the classical method by constructing and interpreting Stribeck curves.

Original languageEnglish (US)
JournalElectrochemical and Solid-State Letters
Issue number8
Publication statusPublished - 2008


ASJC Scopus subject areas

  • Electrochemistry
  • Materials Science(all)

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