@article{891323f6be464688997d42a0ff082704,
title = "Methods to reduce radiation from split ground planes in RF and mixed signal packaging structures",
abstract = "Split ground planes are sometimes used in RF and mixed signal packages in order to isolate the RF and analog circuits from the digital circuits. Undesired radiation in a packaging environment may occur when a signal trace is routed over a slot in the ground plane. This paper examines and investigates ways to eliminate signal coupling into split ground plane structures and assesses the impact of this reduced coupling on signal integrity in a packaging environment. Suggested methods to reduce coupling of energy into the slot are to alter the shape of the slot with RF chokes or corrugations.",
keywords = "Coupling, EMI, FDTD, Mixed signal packaging, Radiated emissions",
author = "Moran, {Tamir E.} and Virga, {Kathleen L.} and Gerardo Aguirre and Prince, {John L.}",
note = "Funding Information: Manuscript received March 1, 2002; revised September 26, 2002. This work was supported in part by the Semiconductor Research Corporation (SRC) under Contract 98PP-086 and the National Science Foundation (NSF) under Contract ECS-9710568. T. E. Moran is with Agilent Technologies, Santa Rosa, CA 95403 USA. K. L. Virga and J. L. Prince are with the Department of Electrical and Computer Engineering, University of Arizona, Tucson, AZ 85721 USA. G. Aguirre is with the Research and New Product Development Group, Ky-ocera America, San Diego, CA 92123 USA. Digital Object Identifier 10.1109/TADVP.2002.805997 Copyright: Copyright 2004 Elsevier Science B.V., Amsterdam. All rights reserved.",
year = "2002",
month = aug,
doi = "10.1109/TADVP.2002.805997",
language = "English (US)",
volume = "25",
pages = "409--416",
journal = "IEEE Transactions on Advanced Packaging",
issn = "1521-3323",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "3",
}