Abstract
Split ground planes are sometimes used in RF and mixed signal packages in order to isolate the RF and analog circuits from the digital circuits. Undesired radiation in a packaging environment may occur when a signal trace is routed over a slot in the ground plane. This paper examines and investigates ways to eliminate signal coupling into split ground plane structures and assesses the impact of this reduced coupling on signal integrity in a packaging environment. Suggested methods to reduce coupling of energy into the slot are to alter the shape of the slot with RF chokes or corrugations.
Original language | English (US) |
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Pages (from-to) | 409-416 |
Number of pages | 8 |
Journal | IEEE Transactions on Advanced Packaging |
Volume | 25 |
Issue number | 3 |
DOIs | |
State | Published - Aug 1 2002 |
Keywords
- Coupling
- EMI
- FDTD
- Mixed signal packaging
- Radiated emissions
ASJC Scopus subject areas
- Electrical and Electronic Engineering