Micro-assembly and packaging of MEMS using optically transparent electrostatic gripper

Eniko T Enikov, Lyubomir Minkov

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This paper describes the assembly experiments with a novel miniature assembly cell for micro-electromechanical systems (MEMS). The cell utilizes a transparent electrostatic gripper and uses several disparate sensing modalities for position control: computer vision for part alignment with respect to the gripper, a fiber-coupled laser, and a position sensitive detector (PSD) for part to assembly alignment. Assembly experiments indicate that the gripping force and stage positioning accuracy are sufficient for insertion of 500μm wide parts in 550 μm wide slots etched in silicon wafers. Details on the cell operation, the control algorithm used and their limitations are also provided. Potential applications of the developed assembly cell are assembly of miniature optical systems, integration of optoelectronics, such as laser diodes with CMOS, and epitaxial lift-off (ELO) of thin films used in optoelectronic devices.

Original languageEnglish (US)
Title of host publicationAmerican Society of Mechanical Engineers, Manufacturing Engineering Division, MED
Pages511-518
Number of pages8
Volume15
DOIs
StatePublished - 2004
Event2004 ASME International Mechanical Engineering Congress and Exposition, IMECE 2004 - Anaheim, CA, United States
Duration: Nov 13 2004Nov 19 2004

Other

Other2004 ASME International Mechanical Engineering Congress and Exposition, IMECE 2004
CountryUnited States
CityAnaheim, CA
Period11/13/0411/19/04

Fingerprint

Grippers
MEMS
Electrostatics
Packaging
Optoelectronic devices
Optical fiber coupling
Position control
Silicon wafers
Optical systems
Computer vision
Semiconductor lasers
Experiments
Detectors
Thin films
Lasers

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Enikov, E. T., & Minkov, L. (2004). Micro-assembly and packaging of MEMS using optically transparent electrostatic gripper. In American Society of Mechanical Engineers, Manufacturing Engineering Division, MED (Vol. 15, pp. 511-518). [IMECE2004-60441] https://doi.org/10.1115/IMECE2004-60441

Micro-assembly and packaging of MEMS using optically transparent electrostatic gripper. / Enikov, Eniko T; Minkov, Lyubomir.

American Society of Mechanical Engineers, Manufacturing Engineering Division, MED. Vol. 15 2004. p. 511-518 IMECE2004-60441.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Enikov, ET & Minkov, L 2004, Micro-assembly and packaging of MEMS using optically transparent electrostatic gripper. in American Society of Mechanical Engineers, Manufacturing Engineering Division, MED. vol. 15, IMECE2004-60441, pp. 511-518, 2004 ASME International Mechanical Engineering Congress and Exposition, IMECE 2004, Anaheim, CA, United States, 11/13/04. https://doi.org/10.1115/IMECE2004-60441
Enikov ET, Minkov L. Micro-assembly and packaging of MEMS using optically transparent electrostatic gripper. In American Society of Mechanical Engineers, Manufacturing Engineering Division, MED. Vol. 15. 2004. p. 511-518. IMECE2004-60441 https://doi.org/10.1115/IMECE2004-60441
Enikov, Eniko T ; Minkov, Lyubomir. / Micro-assembly and packaging of MEMS using optically transparent electrostatic gripper. American Society of Mechanical Engineers, Manufacturing Engineering Division, MED. Vol. 15 2004. pp. 511-518
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