Micro-channel heat sink with integrated temperature sensors for phase transition study

Linan Jiang, Man Wong, Yitshak Zohar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Scopus citations

Abstract

A unique technique of maskless and self-aligned Si etch between bonded wafers was developed and applied to fabricate a micro-channel heat sink integrated with a heater and an array of temperature sensors. The technique allowed the formation of self-aligned and self-stopped etching of grooves between the bonded wafers. The device, consisting of distributed sensors, allowed direct temperature measurements to evaluate local heat transfer rates under forced convection boiling conditions. Temperature distributions along the heat sink were measured for different levels of power dissipation. The onset of critical heat flux (CHF) condition was investigated as a function of channel size and liquid flow rate. The results suggest that the bubble dynamic mechanism in micro-channel maybe different compared with conventional channels.

Original languageEnglish (US)
Title of host publicationProceedings of the IEEE Micro Electro Mechanical Systems (MEMS)
Editors Anon
PublisherIEEE
Pages159-164
Number of pages6
Publication statusPublished - 1999
Externally publishedYes
EventProceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS - Orlando, FL, USA
Duration: Jan 17 1999Jan 21 1999

Other

OtherProceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS
CityOrlando, FL, USA
Period1/17/991/21/99

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ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Jiang, L., Wong, M., & Zohar, Y. (1999). Micro-channel heat sink with integrated temperature sensors for phase transition study. In Anon (Ed.), Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS) (pp. 159-164). IEEE.