Microwave Doppler tomography of high impedance ground planes for aerospace applications

Kelvin J. Nicholson, Thomas Baum, Kamran Ghorbani, Richard W Ziolkowski

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Recent developments in the areas of metamaterials and high impedance ground planes (HIGPs) have created new opportunities for the development of novel multi-functional aerospace materials. One niche application of such materials is the suppression of electromagnetic surface waves across the outer mold line (OML) of aerospace structures. Doppler tomographic imaging and spectral filtering techniques are used to characterize the performance of a simple numerically simulated HIGP. A tapered HIGP concept is introduced to improve the performance over a range of illumination angles. This tapered HIGP is to be embroidered in a commercial aerospace pre-preg material. Experimental results will be presented at the conference.

Original languageEnglish (US)
Title of host publication2016 International Workshop on Antenna Technology, iWAT 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages33-36
Number of pages4
ISBN (Print)9781509002672
DOIs
Publication statusPublished - Mar 16 2016
EventIEEE International Workshop on Antenna Technology, iWAT 2016 - Cocoa Beach, United States
Duration: Feb 29 2016Mar 2 2016

Other

OtherIEEE International Workshop on Antenna Technology, iWAT 2016
CountryUnited States
CityCocoa Beach
Period2/29/163/2/16

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Keywords

  • Aerospace materials
  • Composite materials
  • High impednace groudn plane
  • Metamaterials
  • Tomography

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering

Cite this

Nicholson, K. J., Baum, T., Ghorbani, K., & Ziolkowski, R. W. (2016). Microwave Doppler tomography of high impedance ground planes for aerospace applications. In 2016 International Workshop on Antenna Technology, iWAT 2016 (pp. 33-36). [7434793] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IWAT.2016.7434793