Minimization of water usage for BOE etch processes

Kimberly L Ogden, Elizabeth Castro, Jay Barber

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Buffered oxide etch (BOE) is used to remove oxide layers from wafer surfaces in the semiconductor industry. Measures are being introduced to reduce water usage in semiconductor fabrication. A study was conducted to examine the effects of process variables on wafer quality during etch processing in order to minimize the number of quick dump rinse (QDR) cycles and the initial rinse time. The required amount of water was a function of the wet etchant temperature. pH measurements could be used to minimize the initial overflow rinse time.

Original languageEnglish (US)
Pages (from-to)16-21
Number of pages6
JournalUltrapure Water
Volume19
Issue number5
StatePublished - May 2002

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Oxides
oxide
semiconductor industry
Semiconductor materials
Water
Fabrication
water
Processing
Industry
temperature
Temperature
effect
semiconductor

Keywords

  • Conservation
  • Semi-conductors
  • Wastewater

ASJC Scopus subject areas

  • Fluid Flow and Transfer Processes
  • Water Science and Technology

Cite this

Ogden, K. L., Castro, E., & Barber, J. (2002). Minimization of water usage for BOE etch processes. Ultrapure Water, 19(5), 16-21.

Minimization of water usage for BOE etch processes. / Ogden, Kimberly L; Castro, Elizabeth; Barber, Jay.

In: Ultrapure Water, Vol. 19, No. 5, 05.2002, p. 16-21.

Research output: Contribution to journalArticle

Ogden, KL, Castro, E & Barber, J 2002, 'Minimization of water usage for BOE etch processes', Ultrapure Water, vol. 19, no. 5, pp. 16-21.
Ogden, Kimberly L ; Castro, Elizabeth ; Barber, Jay. / Minimization of water usage for BOE etch processes. In: Ultrapure Water. 2002 ; Vol. 19, No. 5. pp. 16-21.
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